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No. Title Issue Date Stabilized Former No.
Remarks		 Purchase
AE-2001A JStandard connections of serial interface (physical layer) for controls 1989.12
1995.03 		   AE-2001
 The reading system does not support this standard.
AE-4006A JMethods of measurement of vibration characteristic of bolt clamped Langevin type ultrasonic transducer 1992.11
2001.03 		   AE-4006
 The reading system does not support this standard.
AE-5007 JElectrode lead connectors of touch proof type for medical electrical equipment 1994.08  2014.03  T 5037
T 5402
T 5432
 The reading system does not support this standard.
AE-5008 JStyle of particular standards for Electromedical equipment 1995.03  2014.03   The reading system does not support this standard.
AE-5009 JElectronystagmographs 2011.11     
AE-5201B JLow power Medical Telemetry Device Usage Regulations 1989.12
2002.12
2020.09 		 2014.03  AE-5201
AE-5201A
 charge-free,click here
AE-6008 JTest procedure for performance of real-time pulse-echo ultrasonic diagnostic equipment 1997.06     The reading system does not support this standard.
AE-6010A JPerformance testing method of ultrasound elastography 2017.02
2019.03 		   AE-6010
  charge-free,click here
AE-6011 JPerformance testing method of ultrasound attenuation examination function 2025.08      charge-free,click here
AER-4001 JMethods of measurement of ultrasonic transducer for ultrasonic cleaning equipment 2001.01     The reading system does not support this standard.
AER-4002 JMeasuring methods and figure of ferrite magnetostrictive transducer 2003.03     The reading system does not support this standard.
AER-6002 JTest Method of EMC for ultrasonic medical diagnostic equipment 1998.08     The reading system does not support this standard.
AER-6009 JThe measurement of surface temperature for ultrasonic transducer 2005.01     
AEX-2001 JGuideline for describing specification and capability of fuzzy inference engine 1995.03     The reading system does not support this standard.
AEX-2002 JStandard specification of fuzzy system description language 1996.03     The reading system does not support this standard.
CP-1104B JTerms and graphical symbols for AV&ITl equipment 1998.03
2005.03
2014.04 		   CP-1104
CD-ROM付
CP-1104A
 CD-ROM included
CP-1104B-1 JTerms and Graphical Symbols for AV and IT Equipment Amendment 1 2018.03     charge-free,click here
CP-1105 JMethod of Designation for Audio Signal in Audio Visual Equipment 2009.03    CP-1102
 
CP-1106 BTerms and definitions for haptics 2023.12     
CP-1203A JPreferred matching values of analogue signals for AV equipment and systems 1998.07
2007.11 		 2014.03  CPX-1203
CPX-1203-1
CP-1203
 
CP-1205A JSub-carrier frequency allocation for infrared data transmission 1993.01
2001.01 		 2015.01  CP-1205
 
CP-1208 JAnalog Audio and Video Transmission Systems using Infrared Radiation　 2004.01  2015.01  CP-1206
CP-1207
 
CP-1212 JDigital Audio Optical Interface for Consumer Equipment 2002.02  2014.03  CP-1201
 
CP-1221 JVisible Light Communications System 2007.03     
CP-1222 JVisible Light ID System 2007.06     
CP-1223 JVisible Light Beacon System 2013.05     
CP-1301A JMethods of Measurement for Audio Signal in Audio Visual Equipment 2006.11
2014.10 		   CP-2101
CP-1301
 
CP-2150 JMethods of measurement for Digital Audio Equipment 2000.03  2014.03  CPR-2101
 
CP-2201 JMethods of measurement on receivers for amplitude modulated stereophonic soundbroadcasting emissions 1994.03  2016.03   
CP-2301A JMethods of measurement for DAT recorders 2000.01  2014.03  CP-2301
 
CP-2302A JTest tape for DAT recorders 2000.01  2014.03  CP-2302
 
CP-2303A JTest methods of special performance for DAT recorders 2000.01  2014.03  CP-2303
 
CP-2304A JTest tape of special performance for DAT recorders 2000.01  2014.03  CP-2304
 
CP-2307 JDAT cassette system thin tape and recognition holes 1999.07  2014.03  CP-2305-1
 
CP-2313A JMethod of designation for performance on cassette tape recorder 1997.09  2014.03  CP-2313
 
CP-2316 JMagnetic tape analogue sound recording and reproducing system 2005.03  2014.03   
CP-2318A JAudio File Format for Broadcast Use 2010.03
2015.03 		   CP-2318
 
CP-2319 JAudio Pon-Playlist Format for Broadcast Use 2012.07     
CP-2402A JMethods of measuring the characteristics of reproducing equipment for digital audio compact discs 1993.09
2002.06 		 2014.04  CP-307
CP-2402
 
CP-2403A JTest disc for CD players 1993.12
2002.06 		 2014.03  CP-308
CP-2403
 
CP-2404 JMethods of measurement for MiniDisc recorders 2001.03  2015.01  CPX-2401
 
CP-2903B JClassification and measuring method for low magnetic leakage flux loudspeaker systems 1992.03
2002.12
2012.01 		 2017.02  CPZ-111
CP-2903
CP-2903A
 
CP-2905B JMethods of Measurement for Battery Duration on Portable Audio Equipment 1992.03
1998.05
2003.05 		 2015.03  CP-2905A
 
CP-2906A JMethods of Measurement for Battery Duration on Powered Loudspeaker Equipment 2019.12
2024.11 		   CP-2906
 
CP-2907 JMethods of Measurement for Battery Duration on Wearable speaker Equipment 2024.10     
CP-3202B JSpecification standard for color video cameras and camera-recorders 1996.10
2002.03
2009.04 		   VTC-013
CPX-3202
CP-3202
CP-3202A
 
CP-3203 JSpecification of test-charts for video cameras 2002.03  2015.01   
CP-3351 JMethods of measurement for DVD players 2002.11  2015.01   
CP-3451G JExchangeable image file format for digital still cameras : Exif Version 3.0 2002.04
2009.09
2010.04
2013.05
2016.07
2019.05
2023.05
2024.12 		   CP-3451
CP-3451-1
CP-3451A
CP-3451B
CP-3451C
CP-3451D
CP-3451E
CP-3451F
 CD-ROM only
CP-3451G EExchangeable image file format for digital still cameras : Exif Unified Version 3.0 (English version) 2002.04
2009.09
2010.04
2013.05
2016.05
2019.05
2023.05
2024.12 		   CP-3451
CP-3451-1
CP-3451A
CP-3451B
CP-3451C
CP-3451D
CP-3451E
CP-3451F
 CD-ROM only
CP-3461B JDesign rule for Camera File system DCF Unified Version 2.0 2003.09
2009.09
2010.04 		   CP-3461
CP-3461A
 CD-ROM only
CP-3461B EDesign rule for Camera File system DCF Unified Version 2.0 (English version) 2003.09
2009.09
2010.04 		   CP-3461
CP-3461A
 CD-ROM only
CP-3901B EDigital Color Photo Print Stability Evaluation(CD-ROM, with Japanese version) 2007.11
2010.09
2016.06 		   CP-3901
CP-3901A
CP-3901-1
 
CP-4104A JOperating direction for television receivers 1992.03
2005.03
 		 2014.03  CP-4104
 
CP-4108B JMethods of measurement for HDTV displays 1995.03
2006.03
2012.03 		 2016.01  CP-4108
CP-4108A
 
CP-4120A JInterface between digital tuner and television receiver using D-connector 2000.01
2010.03 		 2015.12  CP-4120
 
CP-4120A EInterface between digital tuner and television receiver using D-connector (English version) 2000.10
2010.03 		 2015.12  CP-4120
 
CP-5102E JMethods of measurement on receiving antennas for SHF satellite broadcast transmission (mechanical and environmental characteristics) 1989.03
1995.03
2006.03
2015.03
2020.03
2025.03 		   CP-604-4
CP-5102
CP-5102A
CP-5102B
CP-5102C
CP-5102D
 
CP-5104C JMethods of Measurement on Receiving Antennas for SHF Satellite Broadcast Transmissions (Electrical Characteristics) 1992.03
1995.03
2001.03
2011.05 		 2017.02  CP-604-3
CP-5104A
CP-5104A-1
CP-5104B
 
CP-5110C JMethods of Measurement on Carrier-to-Noise Ratio of Receiving Signals for Digital Satellite Broadcast Transmissions 2007.03
2012.01
2016.02
2022.03 		   CP-5110
CP-5110A
CP-5110B
 
CP-5111C JMethods of Measurement on Terestorial Digital Television Receiving Signal 2009.07
2015.01
2021.03
2026.04 		   CP-5111
CP-5111A
CP-5111B
 
CP-5112B JDesignation of Characteristics of Receiving Antennas for Terrestrial/Satellite Television and FM Broadcast Transmissions 2011.05
2017.02
2022.03 		   CP-5103
CP-5103A
CP-5103B
CP-5112
CP-5112A
 
CP-5113B JTesting Methods of Receiving Antennas For Terrestrial Digital Television and ＦＭ Broadcast Transmissions 2011.05
2018.03
2022.09 		   CP-604-1
CP-5105
CP-5105A
CP-5105B
CP-5113
CP-5113A
 
CP-5114 JCharacteristics of Receiving Antenna for Digital Terrestrial Television Broadcasting 2022.09     
CP-5130B JSpecifications and Performance Requirements on Receiving Antennas for Satellite Broadcast Transmissions 2016.04
2019.03
2024.03 		   CPX-5130
CP-5130A
 
CP-5131B JMethods of Measurement on Receiving Antennas for SHF Satellite Broadcast Transmissions(Electrical Characteristics) 2017.03
2019.03
2024.03 		   CPX-5131
CP-5131A
 
CP-5132 JSpecifications and Performance Requirements on Receiving Antennas for Satellite Digital Broadcast Transmissions in the FSS Band 2022.09     
CP-5205B JMethods of measurement on cable distribution equipment for home use 1996.11
2007.03
2011.05 		 2016.01  CP-5205
CP-5205A
 
CP-5206F JMethods for presenting of cable distribution equipment for home use 1996.11
2002.01
2007.03
2011.05
2017.02
2020.03
2025.03 		   CP-5206
CP-5206A
CP-5206B
CP-5206C
CP-5206D
CP-5206E
 
CP-5207D JMethods of Measurement on DBS-IF Cable Distribution Systems 2004.02
2009.03
2014.03
2017.02
2023.02 		   CP-5204
CP-5207
CP-5207A
CP-5207B
CP-5207C
 
CP-5230C JCable Distribution Equipments for Home Use (3.2GHz) 2016.04
2018.03
2019.03
2024.03 		   CPX-5230
CPX-5230A
CP-5230B
 
CP-5231C JMethods of Measurement on Cable Distribution Equipment for Home Use(3.2GHz) 2016.04
2018.03
2019.03
2024.03 		   CPX-5231
CPX-5231A
CP-5231B
 
CP-6101B Amend.1 JDigital monitor interface GVIF Supplementary Edition 2026.01     
CPR-1202 JIdentification signal of video signals with different aspect ratio and the transfer methods (I) 1995.03  2014.03  CPX-1202
 
CPR-1204 JTransfer method of video ID information using vertical blanking interval (525 line system) 1997.03  2015.01  CPX-1204
 
CPR-1204-1 JTransfer method of video ID information using vertical blanking interval (525P system) 1998.03  2015.01   
CPR-1204-2 JTransfer method of video ID information using vertical blanking interval (750p, 1125i system) 2000.01  2015.01   
CPR-1205A JReference Standards for Digital Audio Interface 2002.02
2014.03 		   CP-1201
CPR-1205
 
CPR-1206 JReport of digital interface technology for HD recording of CS broadcast service 2011.03  2016.01   
CPR-1206-1 JReport of digital interface technology of CS broadcast service(Amendment 1) 2012.07  2016.01   
CPR-1902 JContact designation of connectors for audio / video equipment 1997.03  2015.01   
CPR-2202 JMethods of measurement for receivers for emergency warning broadcast system 1992.02  2015.01  CPZ-001
 
CPR-2312 JContinuous operation performance and durability of cassette tape recorder 1991.12  2014.03   
CPR-2601 JThe Designation of Audio Quality for Memory Audio 2010.03  2015.01   
CPR-3104 JReference Video for Recording Time 2012.07     
CPR-3451A JPresentation method of compressed recording for motion picture and sound for digital cameras(movie/still) 2004.03
2010.03 		   CPR-3451
 
CPR-5103A JNear-field method of measurement on receiving antennas for satellite broadcast transmissions 1995.03
2006.03 		 2015.03  CPR-5103
 
CPR-5105A JSpecifications and Performance Requirements on Receiving Antennas for Satellite Broadcast Transmissions 2002.01
2011.05 		 2016.01  CPR-5105
CPR-5101C
 
CPR-5204F JCable Distribution Equipments for Home Use 1992.03
1997.03
1999.03
2000.10
2003.03
2007.03
2011.05 		 2016.02  CPR-5204B
CPR-5204C
CPR-5204D
CPR-5204E
 
CPR-6101A JDisplay　monitor　interface　report 2012.01
2017.07 		   JEIDA-59
CPR-6101
 
CPR-6201 JEN 301 549(Accessibility requirements suitable for public procurement of ICT products and services in Europe) and standards related to accessibility 2019.03     
ED-2502B BDefining method of display size for Liquid Crystal Display devices 1993.10
2004.12
2011.02 		 2024.10  ED-2502
ED-2502A
 
ED-2511B JTerms,definition and letter symbols for liquid crystal display devices 1989.06
1994.12
2007.03
 		   ED-2511
ED-2511A
 
ED-2521D JMeasuring methods for Liquid Crystal Display panels and constructive materials 1990.02
1993.04
2009.03
2018.03
2020.02
 		   ED-2521
ED-2521A
ED-2521B
ED-2521C
 
ED-2523 JMeasuring methods for matrix reflective LCD modules 2001.03
 		    
ED-2531B JEnvironmental test methods for liquid crystal display devices 1989.06
1992.12
2004.12
 		   ED-2531A
 
ED-2810 BMeasuring methods for Organic EL Display modules 2005.04  2024.10   
ED-2811B JMeasuring methods for Organic LED Display modules (II)– Image sticking, Lifetime – 2013.07
2017.11
2020.02
 		   ED-2811
ED-2811A
 
ED-4002A JTerms and definitions for discrete semiconductor devices 1993.11
2006.01 		   ED-4002
 
ED-4359A JMeasuring Methods of Microwave Semiconductor Devices 2005.12
2025.10 		   ED-4359
 
ED-4511C JEssential ratings, characteristics and testing methods for diodes 1991.11
2002.03
2013.03
2021.05 		   ED-4511
ED-4511A
ED-4511B
 
ED-4521 JEssential ratings characteristics and testing methods for thyristors 1994.01  2019.01  SD-11
SD-21
 
ED-4522 JEssential ratings characteristics and testing methods for turn off thyristors 1995.01  2019.01   
ED-4541A BEssential ratings characteristics and testing methods for high power transistors 1989.05
1999.08 		 2015.06  ED-4541
 
ED-4561B BEssential ratings characteristics and testing methods for high power field effect transistors 1989.03
1999.08
2018.02 		   ED-4561
ED-4561A
 
ED-4562B BEssential ratings, characteristics and testing methods for insulated gate bipolar transistors 1990.03
2000.05
2016.03 		   ED-4562
ED-4562A
 
ED-4701/001B BEnvironmental and endurance test methods for semiconductor devices (General) 2001.08
2013.10
2023.03 		   ED-4701/001
ED-4701/001A
 
ED-4701/002 EProcedure of the test time and the sample size determination for the life tests 2016.03     The reading system does not support this standard.
ED-4701/100B BEnvironmental and endurance test methods for semiconductor devices (Life test I) 2001.08
2013.08
2023.03 		   ED-4701/100
ED-4701/100A
 
ED-4701/200B BEnvironmental and endurance test methods for semiconductor devices (Life test II) 2001.08
2013.10
2023.03 		   ED-4701/200
ED-4701/200A
 
ED-4701/301A BEnvironmental and endurance test methods for semiconductor devices(Stress test I-1) 2013.11
2016.07 		   ED-4701/301
 
ED-4701/302B BEnvironmental and endurance test methods for semiconductor devices (Stress test I-2) 2013.10
2020.09
2025.02 		   ED-4701/302
ED-4701/302A
 
ED-4701/400B BEnvironmental and endurance test methods for semiconductor devices (Stress test II) 2001.08
2013.11
2023.03 		   ED-4701/400
ED-4701/400A
 
ED-4701/500B BEnvironmental and endurance test methods for semiconductor devices (Miscellaneous) 2001.08
2013.10
2023.03 		   ED-4701/500
ED-4701/500A
 
ED-4701/600 BEnvironmental and endurance test methods for semiconductor devices(Specific test for discrete semiconductors) 2013.12     
ED-4702C BMechanical stress test methods for semiconductor surface mounting devices 1992.10
2003.12
2009.07
2015.03 		   ED-4702
ED-4702A
ED-4702B
 
ED-4703 JIn-line evaluation methods and structural analysis methods for semiconductor devices 1994.06     
ED-4703-1 JIn-line evaluation methods and structural analysis methods for semiconductor devices (Amendment1) 1995.03     
ED-4704A BWafer Level Reliability test methods for semiconductor devices 2000.05
2011.07 		   ED-4704
ED-4704-1
 
ED-4705 BTesting Standards for Reliability of Flash Memory 2009.03     
ED-4912B JLight Emitting Diodes 2008.03
2018.03
2024.03 		   ED-4912
ED-4912A
 
ED-5001A B3.3V±0.3 (Normal Range),and 2.7V to 3.6V(Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit 1998.05
2006.04 		    charge-free,click here
ED-5002A B2.5V±0.2 (Normal Range), and 1.8V to 2.7V (Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit 1998.05
2006.04 		    charge-free,click here
ED-5003A B1.8V±0.15 (Normal Range), and 1.2V to 1.95V (Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit 1998.05
2006.04 		    charge-free,click here
ED-5004A B1.5V±0.1 (normal range) and 0.9V to 1.6V (wide range) Power supply voltage and interface standard for non-terminated digital integrated circuit 2000.06
2006.04 		    charge-free,click here
ED-5005A B1.2V±0.1 (normal range) and 0.8V to 1.3V (wide range) Power supply voltage and interface standard for non-terminated digital integrated circuits 2001.03
2006.04 		    charge-free,click here
ED-5006A B1.0V±0.1 (normal range) and 0.7V to 1.1V (wide range) Power supply voltage and interface standard for non-terminated digital integrated circuits 2002.02
2006.04 		    charge-free,click here
ED-5007 BUnified wide power supply voltage range CMOS DC interface standard for non-terminated digital integrated circuits 2010.04     charge-free,click here
ED-5008A JEMC performance equivalence measurement of semiconductor 2020.07
2025.02 		   ED-5008
 
ED-5008A EEMC Performance equivalence test of Semiconductor 2026.04     
ED-5101A JMeasuring methods for Integrated Circuits used in audio-frequency output parts 1992.04
2003.03 		   IC-4
ED-5101
 
ED-5102A JMeasuring methods for integrated circuits for Television Recievers 1992.12
2003.11 		   IC-8
ED-5102
 
ED-5103A JMeasuring methods for Linear Integrated Circuits (Operational amplifier and Comparator) 1992.12
2003.06 		   IC-2
ED-5103
 
ED-5301 JMeasuring methods for solid state image sensors 1996.07    EDX-5301
 
ED-5302 BStandard for I/O Interface Model for Integrated Circuits (IMIC) 2001.03     
ED-5511 JStandard functional specification for synchronous graphic RAM and synchronous video RAM 1995.07     
ED-5512 JStub Series Terminated Logic for 3.3Volts (SSTL_3) (A 3.3V Supply Voltage based Interface Standard for Digital ICs) 1996.03     
ED-5513 BStub Series Terminated Logic for 2.5Volts (SSTL_2) (A 2.5V Supply Voltage based Interface Standard for Digital ICs) 1998.08     
ED-5514 BProcessor Enhanced Memory Module(PEMM) Standard for Processor Enhanced Memory Module Functional Specifications 1998.07     
ED-5515 BStub Series Terminated Logic for 2.5Volts (SSTL_2) Differential Input Signal Specifications 1998.09     
ED-7300A BRecommended practice on standard for the preparation of outline drawings of semiconductor packages 1997.08
2008.01 		 2013.12  ED-7401A
ED-7300
 
ED-7301A BManual for preparation of individual standards of integrated circuits packages 1996.12
2007.03 		 2013.12  ED-7301
 
ED-7302A BManual for preparation of design guides of integrated circuits packages 1997.04
2007.03 		 2013.12  ED-7401-1
ED-7302
 
ED-7303C BName and code for integrated circuits package 1998.06
2001.03
2002.04
2008.03 		   ED-7303A
 
ED-7304 BMeasuring method for package dimensions of ball grid array (BGA) 1997.05  2014.03   
ED-7304-1 BMeasuring method for package dimensions of Small Outline Package (SOP) 1997.03  2014.03   
ED-7305A BUnit Design Guide for the Preparation of Package Outline Drawing of Integrated Circuits (Gullwing-Lead) 1997.04
2012.04 		   ED-7305
 
ED-7306 BMeasurement methods of package warpage at elevated temperature and the maximum permissible warpage 2007.03     
ED-7311-1 BStandard of integrated circuits package (TSOP(1)) 1997.08     
ED-7311-10A BStandard of integrated circuits package (P-BGA (Cavity down type)) 1998.03
1998.11 		   ED-7311-10
 
ED-7311-11A BStandard of integrated circuits package (119/153pins P-BGA) 1998.03
1998.11 		   ED-7311-11
 
ED-7311-12 BStandard of integrated circuits package (52pins 64pins 80pins and 100pins Low-profile Quad Flat Package with Exposed Heatsink) 1998.08     
ED-7311-13A BStandard of Integrated circuits package (P-SON) 1999.01
2002.06 		   ED-7311-13
 
ED-7311-16A BStandard of integrated circuits package (C-LGA) 2000.06
2003.11 		   ED-7311-14
ED-7311-15
ED-7311-16
 
ED-7311-17 BStandard of integrated circuits package (P-ZIP) 2001.06     
ED-7311-18 BStandard of integrated circuits package (P-ILGA) 2002.03     
ED-7311-19 BStandard of integrated circuits package (P-SOP) 2002.01     
ED-7311-2 BStandard of integrated circuits package (TSOP(2)) 1997.08     
ED-7311-20 BStandard of integrated circuits package (P-SSOP) 2002.01     
ED-7311-21 BStandard of integrated circuits package (P-HSOP) 2002.03     
ED-7311-22 BStandards of integrated circuits package (P-QFN) 2002.04     
ED-7311-23 BStandard of Integrated circuits package (PGA) 2002.06     
ED-7311-3A BStandard of integrated circuits package (Tape Ball Grid Array1.0mm pitch(T-BGA)) 1997.08
1999.04 		   ED-7311-3
 
ED-7311-4A BStandard of integrated circuits package (Tape Ball Grid Array1.27mm pitch (T-BGA)) 1997.08
1999.04 		   ED-7311-4
 
ED-7311-5A BStandard of integrated circuits package (SRAM/Flash Fine- Pitch Ball Grid Array (FBGA)) 1998.04
2000.02 		   ED-7311-5
 
ED-7311-6 BStandard of integrated circuits package (60/90pins Fine Pitch Ball Grid Array (FBGA)) 1998.04     
ED-7311-7 BStandard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.5mm pitch (P-FBGA)) 1998.05     
ED-7311-8 BStandard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.8mm pitch (P-FBGA)) 1998.05     
ED-7311-9A BStandard of integrated circuits package (P-BGA (cavity up type)) 1998.03
1998.11 		   ED-7311-9
 
ED-7311A BStandards of integrated circuits package (P-QFP) 1997.05
2002.04 		   ED-7311
 
ED-7316 BDesign guide for semiconductor packages Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA and FLGA) 2008.09     
ED-7318 BDesign guideline of integrated circuits for Plastic Small Outline No-lead package (P-SON) 2013.03    EDR-7318A
 
ED-7324 BDesign guideline of integrated circuits for Plastic Quad Flat Non-leaded package (P-QFN) 2012.02    EDR-7324A
 
ED-7335 BDesign guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) 2010.02     
ED-7340 JAppearance Glossaryfor Semiconductor Package – QFP/SOP, QFN/SON 2025.01     
ED-7341 JVisual Inspection Guideline for Semiconductor Package – QFP/SOP 2025.01     
ED-7342 JVisual Inspection Guideline for Semiconductor Package – QFN/SON 2025.01     
ED-7401-4 BMethod of measuring semiconductor device package dimensions (integrated circuits) 1995.05  2014.03   
ED-7500B BStandard Outlines of Semiconductor Devices(Discrete Semiconductor Devices) 1990.09
1996.07
2015.03 		   ED-7500
ED-7500A
ED-7500A-1
ED-7500A-2
ED-7500A-3
 
ED-7502A BManual for the preparation of outline drawings of discrete semiconductor packages 2006.06
2013.03 		   ED-7502
 
ED-7607 JMatrix fixed trays design guide 2017.05     
ED-7617 BMatrix trays design guide 2013.12     
ED-7618 JTerms and definitions for semiconductor packing 2017.06     
ED-7631 BMarking method for recycle of semiconductor device packing magazines 2001.01
 		    
ED-7701A BGlossary of semiconductor socket for BGA,LGA,FBGA and FLGA 1999.08
2012.03 		   ED-7701
 
ED-7702A BTest Methods for Test and Burn-In Socket 2003.09
2012.03 		   ED-7702
 
ED-7711 BDesign guideline of open-top type socket for Ball Grid Array(BGA) 2014.10     
ED-7712 BDesign guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array(FBGA/FLGA) 2013.03     
ED-7713 BDesign guideline of clamshell type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array(FBGA/FLGA) 2013.03     
ED-7714 BDesign guideline of clamshell type socket for Ball Grid Array and Land Grid Array(BGA/LGA) 2014.10     
ED-7715 BStandard of open-top type socket [54/66 Pin Thin Small Outline Packages (Type 2)] 2006.03     
ED-7716 BStandard of open-top type socket [Fine-pitch Ball Grid Array (FBGA) for Memort IC] 2006.03     
ED-7800 JTransient thermal network model for semiconductor packages(Discrete semiconductor) 2018.06     
ED-7801 JPrinted circuit board specifications to evaluate thermal characteristics of fine pitch semiconductor packages 2018.06     
ED-7803 JJEITA Thermally Accurate Model 2020.02     
ED-7804 JOverview of transient thermal DXRC model 2022.10     
ED-7805 JDXRC model for semiconductor packages (Discrete semiconductor) 2022.10     
ED-7806 JDNRC model for semiconductor packages (Discrete semiconductor) 2023.04     
ED-7807 JDSRC model for semiconductor packages (Discrete semiconductor) 2023.04     
EDR-4101 JLeadless Silicon Diodes 2011.06    ED-4131
ED-4132
ED-4133
ED-4134
 
EDR-4102 JSmall-signal Diodes,Small-signal Transistors and Type designation system for discrete semiconductor devices 2011.06    ED-4001A
ED-4121
ED-4122
 
EDR-4701C BHandling guidance for semiconductor devices 1989.07
1993.02
1996.03
2010.07 		   EDR-4701A
EDR-4701B
 
EDR-4702 JStandard comparison table of quality and reliability test methods for semiconductor devices 1996.03     
EDR-4703A BQuality Assurance Guidelines for Bare Die 1999.05
2008.03 		    
EDR-4704B BApplication guide of the accelerated life test for semiconductor devices 2000.05
2007.03
2020.10 		   EDR-4704A
 
EDR-4705B JSER Testing Guideline
(Refer to EDR-4714 about SEB (Single-Event Burnout).)		 2005.06
2015.07
2023.07 		   EDR-4705
EDR-4705A
 
EDR-4706 BGuide for the Reliability Speciffication of FLASH Memory 2006.01     
EDR-4707A BReport on Failure Mechanism of LSI and reliability test method 2008.03
2018.02 		   EDR-4707
 
EDR-4708C EGuideline for IC Reliability Qualification Plan 2023.06     [CORRIGENDA] JEITA EDR-4708C
EDR-4708C JGuideline for IC Reliability Qualification Plan 2011.04
2013.10
2017.01
2022.10 		   EDR-4708
EDR-4708A
EDR-4708B
 [CORRIGENDA] JEITA EDR-4708C
EDR-4709A BStudy on ESD Test Methods for Semiconductor Components Responding to System Level ESD and Guideline for Assembling on System Boards 2012.07
2019.11 		   EDR-4709
 
EDR-4710 BGuidelines for Handling and ESD Target Levels of Semiconductor Devices 2015.02     
EDR-4711A EGuidelines for Discrete Semiconductor Device Reliability Qualification Plan 2023.03     
EDR-4711A JGuidelines for Discrete Semiconductor Device Reliability Qualification Plan 2016.02
2017.03 		   EDR-4711
 
EDR-4712/100 BNon-destructive recognition procedures of defin Silicon Carbide Wafers (Part 1: Classification of defects) 2016.03     
EDR-4712/200 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 2: The measurement method for defects in Silicon Carbide Wafer by optical inspection) 2017.02     
EDR-4712/400 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 4: The guideline for identifying and evaluating defects in Silicon Carbide Wafers using a combined method of optical inspection and photoluminescence) 2020.12     
EDR-4712/500 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 5: The measurement method for defects in Silicon Carbide Wafer by X-ray topography) 2023.04     
EDR-4712/600 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 6: The guideline for identifying and evaluating defects in Silicon Carbide Wafers using a combined method of optical inspection, photoluminescence and X-ray topography) 2026.04     
EDR-4713 JGuidelines for Compound Power Semiconductor Device Reliability Test Method 2017.06     
EDR-4713-1 EGuidelines for Compound Power Semiconductor Device Reliability Test Method Amendment 1 2023.11     
EDR-4713-1 JGuidelines for Compound Power Semiconductor Device Reliability Test Method Amendment 1 2023.08     
EDR-4714 JNeutron-Induced SEB Testing Guideline 2022.04     
EDR-4715 EProcedures and Glossary of Terms Semiconductor Failure Analysis (1st Edition) 2022.08     
EDR-4715 JThe Procedure and Technical Terms for Semiconductor Failure Analysis 2020.06     
EDR-4715-1 JThe Procedure and Technical Terms for Semiconductor Failure Analysis (First Edition) Supplementary Edition 2025.01     
EDR-4716 BApplication guide of degradation sign analysis for automotive semiconductor devices 2022.04     
EDR-4717 JGlossary of Semiconductor Device Reliability Terms 2023.07     
EDR-4901 JTerms and Definitions for LEDs and Photocouplers 2015.03     
EDR-5202 BASIC performance evaluation guideline 1999.05     
EDR-5504 JA report on 64Mbit density flash memory specification for silicon disk applications without RAM 1996.01     
EDR-7101 JReport on a study of the need for standardization of model specifications for electronic devices 2023.06     charge-free,click here
EDR-7311A BDesign guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) 1996.04
2002.04 		   ED-7404A
EDR-7311
 
EDR-7312 BDesign guideline of integrated circuits for thin small outline package (type1) (TSOPI) 1996.04    ED-7402-3
 
EDR-7313 BDesign guideline of integrated circuits for thin small outline package (type 2) (TSOP2) 1996.04    ED-7402-4A
 
EDR-7314A BDesign guideline of integrated circuits for Plastic Shrink Small Outline Package (P-SSOP) 1996.08
2002.01 		   ED-7402-2A
EDR-7314
 
EDR-7315B BDesign guide for semiconductor packages Ball Grid Array (BGA) 1997.05
1998.11
2006.03 		   EDR-7315A
 
EDR-7317 BDesign guideline of integrated circuits for Surface Vertical Package (SVP) 1998.05    ED-7424
 
EDR-7319 BDesign guideline of integrated circuits for Quad Flat J-Lead Packages (QFJ) 1998.12    ED-7407
 
EDR-7320 BDesign guideline of integrated circuits for Small Outline Package (SOP) 1998.12    ED-7402-1
 
EDR-7321 BDesign guideline of integrated circuits for Quad Flat I-lead package (QFI) 1999.02    ED-7409
 
EDR-7322 BDesign guideline of integrated circuits for Plastic Dual Inline Package (DIP) 1999.04    ED-7403-1
 
EDR-7323A BDesign guideline of integrated circuits for Pin Grid Array (PGA) 1999.05
2002.06 		   EDR-7323
 
EDR-7325 BDesign guideline of integrated circuits for Quad Flat Non-leaded packages (QFN) 1999.05    ED-7412
 
EDR-7326A BDesign guideline of integrated circuits for Plastic Small Outline Package with Heat sink (P-HSOP) 1999.12
2002.03 		   ED-7415
EDR-7326
 
EDR-7327 BDesign guideline of integrated circuits for Single Inline Package (SIP) 2001.01    ED-7413
 
EDR-7328 BDesign guideline of integrated circuits for Plastic Zigzag Inline Package (P-ZIP) 2001.09    ED-7405
ED-7405-1
 
EDR-7329 BDesign guideline of integrated circuits for Plastic Interstitial Land Grid Array package (P-ILGA) 2002.03     
EDR-7330 BDesign guideline of integrated circuits for Plastic Small Outline J-Lead package (P-SOJ) 2002.06     
EDR-7331 BDesign guideline of integrated circuits for Quad Tape Carrier packages and Carrier (QTP and Carrier) 2002.09    ED-7431A
ED-7431-1A
 
EDR-7332 BDesign guideline of integrated circuits for Dual Tape Carrier packages (TYPE1, TYPE2) (DTP(1), DTP(2)) 2002.09    ED-7432
ED-7433
 
EDR-7333 BDesign Guide for Stacked Packages Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA) 2008.05     
EDR-7334 BEvaluation results of typical measurement methods of temperature dependent warpage 2008.05     
EDR-7335 EGlossary for Semiconductor packages (Volum 1:Semiconductor package name and parts name) 2011.09     
EDR-7335 JGlossary for Semiconductor packages (Volume 1: Semiconductor package name and parts name) 2010.11     
EDR-7336 EPackage thermal characteristics guideline in semiconductor products 2014.01     
EDR-7336 JPackage thermal characteristic guideline in semiconductor product 2010.10     
EDR-7337 EThermal characteristics guidelines of two chip stacked semiconductor packages 2015.03     
EDR-7337 JThermal characteristics guidelines of two chip stacked semiconductor packages 2013.10     
EDR-7338 JTemperature measurement guideline using a thermocouple 2016.02     
EDR-7339A JGuideline for package thermal characteristic of power semiconductor module 2022.03
2025.05 		   EDR-7339
 
EDR-7340 JThermal conductivity measurement guideline for semiconductor packaging materials "Molding resin" 2024.11     
EDR-7341 JTechnical summary of thermal model for semiconductor packages 2024.11     
EDR-7342 JThermal Characteristics of Memory Storage Devices Technical Report 2026.04     
EDR-7402 JLow Cl and Br Molding Compound 2021.11     
EDR-7501 JGuideline for applying geometric tolerances to outline drawing of power semiconductor module 2025.11     
EDR-7605 BMarking guideline of packing for lead-free semiconductor device 2004.01     
EDR-7619 JSupplying reel of embossed carrier tape　for semiconductor devices 2013.12     
EDR-7714 BDesign guideline of clamshell type socket for Ball Grid Array and Land Grid array(BGA/LGA) 2008.03     
EDR-7717 JPositioning simulation of semiconductor sockets Technical reports 2010.03     
EDR-7718 JPositioning simulation of semiconductor sockets Technical reports(Socket type FBGA) 2011.04     The reading system does not support this standard.
EDR-7719 JPositioning simulation of semiconductor sockets Technical reports [Socket type QFP] 2014.10     
EDR4712-300 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 3: The measurement method for defects in Silicon Carbide Wafer by photoluminescence) 2018.03     
EDX-7311-24 BMeasurement methods and maximum warpage allowance for soldering stacked packages at elevated temperature 2008.05     
EM-4501A JElectrical test methods for piezoelectric ceramic vibrators 1993.03
2015.10 		   EMAS-6100
EM-4501
 
EM-4501A EElectrical test methods for piezoelectric ceramic vibrators 1993.03
2015.10 		   EMAS-6100
EM-4501
 
EM-4502A JMethod for evaluation of shielding factor of magnetically shielded rooms for environmental magnetic noises at very low frequencies of 1 Hz or less 2012.01
2022.03 		   EM-4502
 
EM-4503A JMethod for evaluation of shielding factor of magnetically shielded rooms for environmental magnetic noises at low frequencies of 200 Hz or less 2015.05
2022.03 		   EM-4503
 
ET-2201 JElectromagnetic compatibility of multimedia equipment - Immunity requirements - 2021.07     charge-free,click here
ET-2301B JMethod of Measurement for CATV System & Equipments 1992.07
2003.03
2009.03 		 2017.03  CTC-001
ET-2301
ET-2301A
 The reading system does not support this standard.
ET-2303C JGraphic Symbols for Cable Television Sytems 1993.09
1999.10
2008.03
 		 2017.03  ET-2303
ET-2303A
ET-2303B
 
ET-2306A JMethod of measurement for digital CATV system & equipments 1998.10
2004.12 		 2017.03  ET-2306
 
ET-2502A BDesignation items and methods for equipment using low voltage d.c. power supply plugs and jacks 2002.02
2010.03 		   ET-2501A
ETX-2551
ETX-2552
ET-2502
 
ET-4101 JPrinted Electronics – Materials – Part 1-1: Substrate (polymer and glass) 2013.02     
ET-4201 JPrinted Electronics – Materials – Part 2-1: Ink of functional materials – Conductive material ink 2013.02     
ET-4501 JPrinted Electronics – OLED elements – Mechanical stress testing of OLED elements formed on flexible substrates 2015.06     
ET-5102A JStandard of 3D Annotated Models - Datum Systems, JEITA General Tolerancing - 2015.05
2021.04 		   ET-5102
 
ET-5102A EStandard of 3D Annotated Models - Datum Systems, JEITA General Tolerancing - 2015.05
2021.04 		   ET-5102
 
ET-7104 JStandard about reality of packaging of components for automatic handling affects mounting and related electrostatic standards judged from these packaging 2016.04     
ET-7104-1 JMeasuring methods of electrostatic potential and charge decay while cover tape is peeled off from carrier of SMD taping 2016.04     
ET-7104-2 JAdditional notes of measuring methods of electrostatic potential and charge decay while cover tape is peeled off from carrier of SMD taping (JEITA ET-7104-1)[2018.02] 2016.04     
ET-7105 EStandard on paper taping specifications required　for AUTO LOADING FEEDER 2019.08     
ET-7105 JStandard on paper taping specifications required for AUTO LOADING FEEDER 2018.11     
ET-7200C JReusable reel for packaging of components for automatic handling 1997.07
1999.12
2003.10
2010.10 		   ET-7200
ET-7200A
ET-7200B
 
ET-7304A EDefinition of Halogen-free Soldering Materials 2009.03
2010.04 		   ET-7304
 
ET-7305 JGuideline for Selection of Lead-Free Materials for Tin-Whisker Mitigation 2010.06     
ET-7404 JSolderability testing of electronic components for surface mount technology by the wetting balance method with solder paste 1997.03
 		    
ET-7405 BTest methods of ultrasonic cleaning exposure of surface mounting devices 1998.03
 		   RCX-0103
 
ET-7407B JEndurance test methods of solder joint for CSP and BGA package on mounting condition 1999.12
2010.06
2012.12 		   ET-7407
ET-7407A
 
ET-7409/101A JTest methods for solder joint of surface mount device - Part101: Pull strength test 2005.11
2010.04 		   ET-7409/101
 
ET-7409/102A JTest methods for solder joint of surface mount device - Part102: Shear strength test 2005.11
2010.04 		   ET-7409/102
 
ET-7409/103A JTest methods for solder joint of surface mount device - Part103: Torque shear strength test 2005.11
2010.04 		   ET-7409/103
 
ET-7409/104A JTest methods for solder joint of surface mount device - Part104: Monotonic bending strength test 2005.11
2010.04 		   ET-7409/104
 
ET-7409/105A JTest methods for solder joint of surface mount device - Part105 : Cyclic bending strength test 2005.11
2010.04 		   ET-7409/105
 
ET-7409/106A JTest methods for solder joint of surface mount device - Part106：Cyclic drop test 2005.11
2010.04 		   ET-7409/106
 
ET-7409/107 JTest methods for solder joint of surface mount device - Part107：Cyclic steel ball drop test 2010.04     
ET-7409/201 ESurface mount technology-Environmental and endurance test methods for solder joint of lead terminal type device Part201: Pull strength test 2005.11     charge-free,click here
ET-7409/202 ESurface mount technology-Environmental and endurance test methods for solder joint of lead terminal type device Part202: Creep strength test 2005.11     charge-free,click here
ET-7409A JSurface mount technology-Environmental and endurance test methods for solder joint of surface mount device or lead terminal type device Part0: Selection of the test methods 2005.11
2008.07 		   ET-7409
 
ET-7411 JENVIRONMENTAL TESTING: Solderability testing of electronic components for miniature surface mounting devices by the wetting balance method 2009.04     
ET-7501 JLand pattern design guideline for surface mount devices (SMDS) : Generic requirements 2003.03
 		    
ET-7501-1 BDrawing guidline for the outline of surface mount devices (SMDs) for land pattern design 2014.03     
ET-7501/101 JLand pattern design for surface mount devices (SMDs) : Sectional requirements (Rectangular or square-end components, cylindrical end cap terminations, Inward L shaped ribbon leads, Flat leads) 2003.03
 		    
ET-7501/105 JLand pattern design guideline for surface mount devices (SMDs) : Sectional requirements (Chip carriers with J-Leads on four sides) 2006.09     
ET-7503 JComponent shape data specification for CAD libraly - Generic descriptions of the 2D and 3D descriptions for components shape data 2012.09     
ET-7504 B3D data design guideline for Part technical information utilization of electronic and electronics components 2014.03     
ET-7505A JRequirements for through hole reflow (THR) soldering 2018.04
2020.06 		   ET-7505
 
ET-7506 JRequirements for terminal coplanarity of electronic components at room temperature and reflow heating 2020.07     
ET-9101 JPhotovoltaic device evaluation method for indoor light 2016.03     
ETR-3001 JThermal Guidelines for Japan Green Datacenters 2020.05     
ETR-7001 BTerms and definitions for surface mount technology 1998.09
 		    
ETR-7002 JGuideline for promotion of recovery and reuse about reusable reel for tape packaging of surface mount device 1996.08
 		    
ETR-7005 JReport of investigation on bulk case for surface mounting devices 1997.06
 		    
ETR-7009 JGuideline for practical use of Reusable bulk case for surface mounting devices 2000.03     
ETR-7011 JGuide for reusable and/or recycable mark on containers and packaging for electronic components 2001.04
 		    
ETR-7013A JGuideline for bulk feeding 2002.07
2009.03
 		   ETR-7013
 
ETR-7014 JReport of investigation on bulk feeding and mounting for chip resistors rectangular type 2002.03
 		    
ETR-7015 JReport of evaluation on miniature bulk case for surface mounting components 2002.03
 		    
ETR-7016 JReport of investigation on mechanical matching between bulkcased SMDs and feeding mechanism 2002.03
 		    
ETR-7016-1 JReport of investigation on mecanical matching between bulkcased SMDs and feeding mechanism Amendment 1(2003.04) 2002.03
 		    
ETR-7017 JInvestigative report of problem for Packaging of surface mount components on continuous tapes 2003.08
 		    
ETR-7022 JGuidance of taping for surface mount components 2004.04
 		    
ETR-7023 JSecond-generation Flow Solder Alloy Standardization Project Group Activity Report 2007.06     
ETR-7024 JResearch Report on Effect of Voids on Reliability of Lead-Free Solder Joints and Standard of Evaluation Criteria 2007.06     
ETR-7025 JInvestigation report on W8P1 specifications(8 mm in width,1 mm in pocket pitch)in tape packaging of surface mount components 2009.04
 		    
ETR-7026A JTerms and definitions for packaging of components on automatic handling 2007.04
2025.04 		   ETR-7026
 
ETR-7027 JSecond-generation Reflow Solder Paste Standardization Project Group Activity Report(I) 2011.11     
ETR-7028 ESecond-generation Reflow Solder Paste Standardization Project Group Activity Report (Final) 2012.10     
ETR-7028 JSecond-generation Reflow Solder Paste Standardization Project Group Activity Report(Final) 2012.10     
ETR-7029 JSurvey and Evaluation of some alternative Lead-free solders for high melting temperature Lead containing solders 2017.03     
ETR-7030 ETechnical report on emboss taping specifications required forfor AUTO LOADING FEEDER 2019.08     
ETR-7030 JTechnical report on emboss taping specifications required for AUTO LOADING FEEDER 2018.11     
ETR-7031 JExperimental proving test report of Sn-Ag-Cu solder joint life prediction 2019.03     
ETR-7032 JGuidelines on current temperature regulation and issues regarding the operating temperatures of electrical and electronic components 2020.11     
ETR-7033 JGuidelines for measuring temperature of electric and electronic components 2021.01     
ETR-7034 JThermal design guidelines for printed circuit boards with mounted components that dissipate heat through the board 2021.01     
ETR-7035 BInterim report of survey and evaluation of Sn whisker growth on low-temperature soldering 2021.06     
ETR-7036 BTechnical Guideline for JISSO MID 2025.12     
IT-1002A JInstallation environmental standards of the information system 2003.03
2011.04 		   IT-1002
 
IT-1003 JRecording format for data exchange 2004.06     The reading system does not support this standard.
IT-1004B JStandard Operating Conditions of Industrial Computer/Control System 1979.02
2007.03
2011.03
2017.03 		   JEIDA-63-2000
IT-1004
IT-1004A
 
IT-3001A JImmunity Test Methods and Limits for Information Technology Equipment and Systems 2004.04
2010.03 		   IT-3001
 
IT-3002A JVoltage Dip Immunity of Personal Computer 2003.03
2010.03 		   IT-3002
 
IT-3011A JStandards of Printer Evaluation pattern 2003.03
2014.06 		   JEIDA-46
IT-3011
 CD-ROM included
IT-4001 JSpeech Synthesis System Performance Evaluation Methods 2003.02    JEIDA-G24
 JEIDA-G24
IT-4003 JSymbols for Japanese Speech Recognizer 2005.03     
IT-4005 JThe Guidelines for Performance Evaluation of Speech Recognition Engine 2008.02     
IT-4006 JSymbols　for　Japanese Text-To-Speech Synthesizer 2010.03     
IT-4007 JThe Guidelines for Design of Voice Commands in Application Systems with Speech Recognition 2012.07     
IT-4008A JPronunciation Dictionary　for Japanese Speech Synthesizer　 2013.03
2014.06 		   IT-4008
 
IT-4012 JThe Guideline　for TTS Speaking Style Classification 2018.07     
ITR-1001D JGuideline of Facilities and equipment for Information Systems 2002.01
2003.03
2006.05
2011.03
2014.03 		   ITR-1001A
ITR-1001B
ITR-1001C
 
ITR-1005B JGuideline for earthing of information processing systems 2007.12
2011.04
2017.10 		   JEIDA-G-23
ITR-1005
ITR-1005A
 
ITR-1006B JExtinguishment facilities guideline of the information system room 2009.03
2011.04
2016.03 		   ITR-1006
ITR-1006A
 
RC-0901 JMarking code for manufacturing data and manufacturing weeks of electronic parts 1992.03     
RC-2002 JLow ESL measuring method on surface mount capacitors for use in electrical and electronic equipment 2006.03     
RC-2003 JLow ESL measuring method on capacitors with lead terminal for use in electrical and electronic equipment 2006.04     
RC-2110 JMethod for measurement of high frequency characteristics in fixed resistors 2001.03     
RC-2121 JThick film chip conductors rectangular type 1992.03     
RC-2123A JFixed resistors for use in electoronic equipment Detail specification: Fixed power wirewound resistors (rectangular) Stability class 5%-Assemssment level E 1992.11
1998.11 		   RC-2123
 
RC-2125A JFixed resistors for use in electronic equipment detail specification : Fixed metal film fusing resistors, insulated type-Form14 Stability class 5% - Assessment level E 1993.03
2001.03 		   RC-2125
 
RC-2127A JSurface mount metal film conductors cylindrical type‐Forms27 Assessment level E 1992.10
2010.04 		   RC-8011
RC-2127
 
RC-2128A JFixed resistors for discharge path‐Forms 05 and 14 Stability class 10%-Assessment level E 1994.01
2010.04 		   RC-2128
 
RC-2129 JFixed surface mount resistor networks (Isolated terminals) 2000.06     
RC-2130 JFixed surface mount resistor networks (Common terminals) 2000.06     
RC-2131A JFixed resistors for use in electoronic equipment Detail specification: Fixed carbon film chip resistors cylindrical type-Form 27 Stability class 5%-Assessment level E 1995.01
1998.10 		   RC-2131
 
RC-2132A JFixed resistors for use in electoronic equipment Detail specification: Fixed metal film chip resistors cylindrical type-Form 27 Stability class 1%-Assessment level E 1998.10
2003.12 		   RC-2132
 
RC-2133C JFixed resistors for use in electronic equipment Detail specification :Surface mount metal film fixed resistors rectangular type - Form 73 Stability Class 1% - Assessment level E 1995.01
1998.10
2002.03
2010.04 		   RC-2133A
RC-2133B
 
RC-2134C JFixed resistors for use in electronic equipment Detail specification :Surface mount thick film fixed resistors rectangular type - Form 73 Stability Class 5% - Assessment level E 1995.01
1998.10
2002.03
2010.04 		   RC-2134A
RC-2134B
 
RC-2136 JFixed resistors for use in electoronic equipment Detail specification: Fixed carbon film chip resistors -Form 14 Stability class 5%-Assessment level E 1998.01     
RC-2137 JFixed resistors for use in electoronic equipment Detail specification: Fixed metal film resistors -Form 14 Stability class 2%-Assessment level E 1998.01     
RC-2138 JFixed resistors for use in electoronic equipment Detail specification: Fixed metal oxide film resistors -Form 12,14 Stability class 5%-Assessment level E 1998.01     
RC-2141 JFixed resistors for use in electoronic equipment Detail specification: Fixed power wirewound resistors (Flat with tag terminals) Stability class 5%-Assessment level E 1998.11     
RC-2142 JFixed resistors for use in electoronic equipment Detail specification: Fixed power wirewound resistors (Cylindrical with axial leads) Stability class 5%-Assessment level E 1998.11     
RC-2143 JFixed resistors for use in electoronic equipment Detail specification: Fixed power wirewound resistors (Cylindrical with tag terminals) Stability class 5%-Assessment level E 1998.11     
RC-2144 JFixed resistors for use in electronic equipment Detail specification:Surface mount low resistance rectangular fixed resistors-Form 73 Stability class 5%-Assessment level E 2010.04     
RC-2145 JFixed resistors for use in electoronic equipment Detail specification: Fixed metal film resistors of positive temperature coefficient for surface mount rectangular type-Form73 Stability class 5%-Assessment level E 2004.04    RC-2135
 
RC-2161 JSurface mounting pre-set potentiometers for use in electronic equipment, standard dimensions of land pattern of PWB 1991.01    RCF-2002
 
RC-2162 JDimensions of bushing and shaft for dual shaft potentiometers 1993.02    RC-2684B
 
RC-2163 JInsulated shaft, carbon composition potentiometers for use in electronic equipment 1993.02    RC-2656A
 
RC-2164 JPreset carboncomposition potentiometers for use in electronic equipment-characteristic CA, CB, LA, LB, MA and MB 1993.03    RC-2657A
 
RC-2165 JNon-wirewound lead-screw and rotary preset potentiometers for use in electronic equipment-characteristics Y 1993.03    RC-2662A
 
RC-2166 JSlide-type potentiometers for use in electronic equipment 1993.03    RC-2648B
 
RC-2181 JTest methods of precision potentiometers for use in electronic equipment 1993.12     
RC-2322C JFixed capacitors for use in electronic equipment - Detail specificaiton: Dimensions of fixed surface mount multilayer ceramic capacitors 1995.03
2007.03
2014.09
2017.01 		   RC-2322
RC-2322A
RC-2322B
 
RC-2342A JRequirements for metallized polyethylene terephthalate (PET) films for capacitors 1996.07
2002.07 		   RC-2342
 
RC-2342A-1 JRequirements for metallized polyethylene terephthalate (PET) films for capacitors Amendment1(2004.02) 1996.07
2002.07 		   RC-2342
 
RC-2348A JRequirements for metallized polypropylene (PP) films for capacitors 1993.12
2002.07 		   RC-2348
 
RC-2348A-1 JRequirements for metallized polypropylene (PP) films for capacitors Amendment1(2004.02) 1993.12
2002.07 		   RC-2348
 
RC-2352 JFixed capacitors for use in electronic equipment part 2 : Detail specification (guidance) : Fixed metallized polyethylene-terephthalate film dielectric d.c.capacitors assessment level E 1999.03     
RC-2364A BTest methods of electrode foil for aluminium electrolytic capacitors 1992.11
1999.03 		   RC-2364
 
RC-2365B BFixed capacitors for use in electronic equipment-Part 4 : Detail specification (guidance) : Fixed aluminium electrolytic capacitors with non-solid electrolyte for use in electronic flash equipment Assessment level E 1992.07
1999.03
2007.12 		   RC-2365A
 
RC-2366A JFixed capacitors for use in electronic equipment - Part 4 : Detail Specification (guidance) : Fixed aluminium electrolytic bi-polar capacitors with non-solid electrolyte Assessment level E 1993.03
1998.03 		   RC-2366
 
RC-2369 JMatrixes tray for alminium electrolytic capacitors 2001.11    RCX-2369
 
RC-2371A JRecommended case size of fixed electrolytic capacitors with solid and non-solid electrolyte for use in electronic equipment 1997.03
2004.03 		   RC-2371
 
RC-2372 JTest methods of seal performance of aluminium electrolytic capacitors with non-solid electrolyte for use in electronic equipment 1997.03     
RC-2520A JRadial leads and axial leads inductors for use in electronic equipment (fixed type) 1993.10
2001.11 		 2014.05  RC-4008
RC-2520
 
RC-2530B JFixed surface mount inductors for use in electric and telecommunication equipment 1993.10
2001.11
2009.03 		   RC-4011
RC-2530
RC-2530A
 
RC-2594 JTest methods of delay line for electronic equipment 1995.03  2014.05  RC-4012
 
RC-2720A JPin terminal dimensions of transformer for electronic equipment 1988.10
1996.02 		   RC-2720
 
RC-2723A JMeasuring method of leakage flux of transformer for electronic equipment 1991.03
1996.06 		   RC-2723
 
RC-2724A JDimension of laminated core of transformers for electronic equipment 1994.07
2001.03 		   RC-4502
RC-2724
 
RC-2726 JTest methods of transformers for switching power supplies 1999.03     
RC-2727 JMeasuring method of sound level of transformer for electronic equipment 2001.03    RC-2722
 
RC-4501 JSPD disconnectors for low-voltage surge protective devaices Performance requirements and test methods for SPD fusing disconnector (SFD) 2013.12     
RC-4502 JSPD disconnectors for low-voltage surge protective devaices Selection and application principles for SPD fusing disconnector (SFD) 2013.12     
RC-5121A JDual-in-line package switches for use in electronic equipment 1991.03
1997.03 		 2017.04  RC-5121
 
RC-5123A JPower switches for use in electronic equipment 1991.03
2012.11 		 2017.04  RC-5601
RC-5123
 
RC-5125A JSlide switches for use in electronic equipment 1994.02
2017.02 		 2017.04  RC-5602A
RC-5125
 
RC-5126A JPush-button Switches with Tactile Feeling for use in Electronic Equipment 1994.04
2001.10 		 2017.04  RC-5605
RC-5126
 
RC-5127A JDIP rotary switches for use in electronic equipment 1994.07
2000.03 		 2017.04  RC-5127
 
RC-5129 JRotary switches for electronic equipument 1996.03  2017.04   
RC-5130 JToggle switches for use in electronic equipment 1997.03  2017.04   
RC-5200 JTerms and definitions for connectors 1993.12     
RC-5203A JY/V (S VIDEO) Connector 1992.03
1997.03 		   RC-5203
 
RC-5204A JAuto iris lens connector for CCTV camera 1999.03
2011.05 		   RC-5204
 
RC-5220B JType C12 connectors for radio frequency coaxial cables 1993.03
1999.03
2005.11 		   RC-5220A
 
RC-5221A JType C13 connectors for radio frequency coaxial cables 1993.03
1999.03 		   RC-5221
 
RC-5222A JType C14 connectors for radio frequency coaxial cables 1993.03
1999.03 		   RC-5222
 
RC-5223C JType C15 connectors for radio frequency coaxial cables 1992.12
1999.04
2015.10
2018.01 		   RC-5223
RC-5223A
RC-5223B
 
RC-5224A JInsulation displacement connectors for electronic equipment 1992.11
1997.12 		   RC-5224
 
RC-5226 JCircular connectors for audio equipment 1993.03    RC-6709A
 
RC-5231A JPin plugs and pin jacks for electronic equipment 1993.03
2010.04 		   RC-6703A
RC-5231
 
RC-5233 JType BNC75Ω connectors for radio frequency coaxial cables 1999.03    RCX-5233
 
RC-5234 JType SMA connectors for radio frequency coaxial cables 1999.07    RCX-5234
 
RC-5235 JType TNC connectors for radio frequency caxial cables 1999.03    RCX-5235
 
RC-5236 JCircular connectors, latch lock type for audio equipment 1999.03    RCX-5232
 
RC-5237 JD Connector for Digital Broadcasting Component Video Signal (Y,Pb,Pr) connection 1999.07     
RC-5238A JConnector "A" for IMT-2000 cellular phone 2000.03
2007.03 		   RC-5238
 
RC-5240 JRectangular Connector for Mobile Phone 2003.03     
RC-5241 JWhisker test methods for electronic connectors (Japanese version) 2007.09     
RC-5242 JComposite I/O Connector for Cellular Phone 2008.06     
RC-5320A BPlugs and jacks for coupling an external (unified polarity type) 1989.09
1992.03 		   RC-6705
RC-5320
 
RC-5321 BJacks for low voltage DC power supply output and mating plugs 1998.03    RCX-5321
 
RC-5322 BPlugs and jacks for coupling DC 12/24V power supply to electronic equipment used in a car 1998.03    RCX-5322
 
RC-5325A B4-Pole miniature concentric plugs and jacks 1993.05
2004.04 		   RC-5325
 
RC-5326 JAC Inlet for Audio Visual Equipment 2003.01    RCX-5326
 
RC-5327 J4-Pole Micro Concentric Plugs and Jacks 2009.11     
RC-5720C BConnectors for Optical Fiber Cables for Digital Audio Equipment 1989.09
1999.12
2006.10 		   RC-5720B
 
RC-6600 JDimensions of Ribbon Cassette for Thermal Printer 1990.03     
RC-8100E JGeneral Rules for Sound System Equipment 1991.01
2004.03
2009.03
2014.01
2019.03
2024.04 		   RC-8100
RC-8100A
RC-8100B
RC-8100C
RC-8100D
 
RC-8101F JGeneral terms for electro-acoustic transducers and systems 1989.03
1994.03
2002.04
2008.03
2013.12
2018.03
2023.03 		   RC-8101
RC-8101A
RC-8101B
RC-8101C
RC-8101D
RC-8101E
 
RC-8102C JDimensions of ferrite magnet for electroacoustic transducers 1991.09
2004.03
2009.03
2014.01 		   RC-7657B
RC-8102
RC-8102A
RC-8102B
 
RC-8103C JDimensions of casting magnet for electroacoustic transducers 1991.09
2004.03
2009.03
2014.01 		   RC-7658A
RC-8103
RC-8103A
RC-8103B
 
RC-8104E JMicrophones and earphones for speech communications 1991.05
2001.03
2011.06
2016.03
2021.04
2026.04 		   RC-8104
RC-8104A
RC-8104B
RC-8104C
RC-8104D
 
RC-8105C JDimensions of rare earth magnet for electroacoustic transducers 1992.12
2004.03
2009.03
2014.01 		   RC-8105
RC-8105A
RC-8105B
 
RC-8124D JLoudspeaker systems 1995.03
2001.11
2012.01
2017.02
2022.03 		   RC-8120
RC-8121
RC-8122
RC-8124
RC-8124A
RC-8124B
RC-8124C
 
RC-8125D JPiezoelectric loudspeakers 1999.05
2009.03
2014.03
2019.03
2024.04 		   RCX-8100
RC-8125
RC-8125A
RC-8125B
RC-8125C
 
RC-8126C JLoudspeaker system with built-in amplifier 2001.03
2012.01
2017.02
2022.03 		   RC-8126
RC-8126A
RC-8126B
 
RC-8127C JElectrodynamic loudspeakers 2001.03
2012.01
2017.02
2022.03 		   RCX-8101
RC-8127
RC-8127A
RC-8127B
 
RC-8140D JHeadphones and earphones 1998.03
2010.03
2015.01
2020.06
2026.04 		   RC-7501A
RC-8141
RC-8140
RC-8140A
RC-8140B
RC-8140C
 
RC-8141D JHeadphones for Hi-Fi Listening 2002.12
2008.03
2013.03
2016.03
2022.03 		   RCX-8102
RC-8141
RC-8141A
RC-8141B
RC-8141C
 
RC-8142B JHeadphones and earphones with active noise canceling functions 2013.02
2018.03
2024.04 		   RC-8142
RC-8142A
 
RC-8160D JMicrophones 1988.09
2002.03
2012.09
2018.03
2024.04 		   RC-8160
RC-8160A
RC-8160B
RC-8160C
 
RC-8162E JPower supply feeding for microphones 1990.05
1996.07
2005.03
2013.07
2018.05
2023.03 		   RC-8162
RC-8162A
RC-8162B
RC-8162C
RC-8162D
 
RC-8163E JTest methods of cords for microphones or earphones 1996.07
2005.03
2010.03
2015.01
2020.06
2025.03 		   RC-8161
RC-8163
RC-8163A
RC-8163B
RC-8163C
RC-8163D
 
RC-8180F JSounders and buzzers 1991.01
1994.09
2005.03
2010.03
2015.01
2020.06
2025.03 		   RC-8180
RC-8180A
RC-8180B
RC-8180C
RC-8180D
RC-8180E
 
RC-9131D JTest methods of switching power supplies (AC-DC) 1994.10
2001.03
2007.12
2012.11
2019.03 		   RC-9002A
RC-9131
RC-9131A
RC-9131B
RC-9131C
 
RC-9141B JTest methods of switching power supplies (DC-DC) 1995.01
2012.11
2019.03 		   RC-9141
RC-9141A
 
RCR-1001C JSafety application guide on components for use in electronic and electrical equipment 1999.09
2007.03
2017.09
2023.03 		   RCR-1001
RCR-1001A
RCR-1001B
 
RCR-2001 JGuidance of Assessment level EZ 2003.03  2015.02   
RCR-2002 JTechnical report of low ESR/ESL measuring method on surface mount capacitors 2006.03  2018.03   
RCR-2003 JTechnical report of low ESR/ESL measuring methods on aluminium electrolytic capacitors with lead terminal for use in electrical and electronic equipment 2005.01  2018.03   
RCR-2004 JReport of low ESL measurement methods for aluminium electrolytic capacitors with screw terminal 2009.03     
RCR-2112 JMethod for measurement of low resistance 1999.04     
RCR-2113 JVarification for method of measurement of high frequency characteristics in fixed resistors 2002.03     
RCR-2114 JStudy for the derating curve of fixed surface mount resistors 2014.10     
RCR-2115 JVerification for method of measurement of current noise in fixed resistors 2015.03     
RCR-2121A EGuideline of notabilia for fixed resistors for use in electronic equipment (Safety Application Guide for fixed resistors for use in electronic equipment) 1995.01
2006.04 		    
RCR-2121B JGuideline of notabilia for fixed resistors for use in electronic equipment (Safety Application Guide for fixed resistors for use in electronic equipment) 1995.01
2002.07
2015.02 		   RCR-2121
RCR-2121A
 
RCR-2122 JVerification of Sulfurization Test Method for Surface Mount Fixed Resistors 2024.08     
RCR-2191A JGuideline of notabilia for potentiometers for use in electronic equipment (Safety Application Guide for potentiometers) 1994.07
2002.03 		 2015.09  RCR-2191
 
RCR-2191A ESafty Application Guide for potentiometers for use in electronic equipment 1994.07
2006.07 		   RCR-2191
 
RCR-2334A JGuideline of notabilia for variable pre-set ceramic capacitors (Safety Application Guide for variable pre-set ceramic capacitors) 1995.03
2002.03 		 2014.05  RCR-2334
 
RCR-2335C ESafety application guide for fixed ceramic capacitors for use in electronic equipment
Safety application guide for fixed ceramic capacitors for use in electronic equipment Amendment 1 (2021.07)		 2002.03
2006.03
2014.03 		   RCR-2335
RCR-2335A
 RCR-2335C Amend.1
RCR-2335C JSafety application guide for fixed ceramic capacitors for use in electronic equipment
Safety application guide for fixed ceramic capacitors for use in electronic equipment Amendment 1 (2021.07)		 2002.03
2006.03
2008.03
2014.03 		   RCR-2335A
RCR-2335B
RCR-2335B-1
 RCR-2335C Amend.1
RCR-2335C-1 JSafety application guide for fixed ceramic capacitors for use in electronic equipment Amendment 1 2021.07     RCR-2335C Amend.1
RCR-2335C-1 ESafety application guide for fixed ceramic capacitors for use in electronic equipment Amendment 1 2021.07     RCR-2335C Amend.1
RCR-2340 JA report on insulation resistance of domestic metallized filmcapacitors 2000.04     
RCR-2350C ESafety Application Guide for fixed plastic film capacitors for use in electronic equipment 1995.03
2002.07
2007.03 		   RCR-2350B
 
RCR-2350D JGuideline of notabilia for fixed plastic film capacitors for use in electronic equipment “Safety Application Guide for fixed plastic film capacitors for use in electronic equipment” 1995.03
2002.07
2012.11 		   RCR-2350A
RCR-2350B
 
RCR-2360A JReliability reports of aluminium electrolytic capacitors for general inverter 1990.03
2000.03 		 2014.09  RC-2360
 
RCR-2367D JSafety application guide for fixed aluminium electrolytic capacitors for use in electronic equipment
Safety application guide for fixed aluminium electrolytic capacitors for use in electronic equipment Amendment 1(2019.03)		 1995.03
2002.03
2017.10 		   RCR-2367A
RCR-2367B
 *Set with RCR-2367D Amend.1
RCR-2367D ESafety Application Guide for fixed aluminium electrolytic capacitors for use in electronic equipment 1995.03
2002.03
2006.03
2019.03 		   RCR-2367B
RCR-2367C
 
RCR-2367D-1 JSafety application guide　for fixed aluminium electrolytic capacitors　for use in electronic equipment　Amendment 1　 2019.03     ＊RCR-2367D Amend.1 only
RCR-2368C JSafety application Guide for fixed tantalum electrolytic capacitors with solid electrolyte for use in electronic equipment 1995.03
1998.05
2002.03
2015.09 		   RCR-2368A
RCR-2368B
 
RCR-2370B ESafety Application Guide for fixed electric double layer capacitors 1995.03
2002.03
2006.03 		   RCR-2370A
 Note:
The latest version of safety application guide for fixed electric double layer capacitors is RCR-2370C. No English version of RCR-2370C is available at present. Until the next English version is published, RCR-2370B will be provided as the latest English version.
RCR-2370C JSafety Application Guide for electric double layer capacitors (Guideline of notabilia for electric double layer capacitors) 1995.03
2002.03
2008.07 		   RCR-2370B
 
RCR-2377 JSafety application guide for lithium ion capacitors 2013.12     
RCR-2501C ESafety application guide for inductorsfor use in electronic and electrical equipment 2001.10
2006.03
2019.03 		   RCR-2501
RCR-2501A
 
RCR-2501C JSafety application guide for inductorsfor use in electronic and electrical equipment 2001.10
2006.03
2009.08
2019.03 		   RCR-2501A
RCR-2501B
 
RCR-2502 JTerms and definitions of high frequency coil for electronic equipment 2005.03     
RCR-2702 JSafety Application Guide for Transformers 2001.03     
RCR-4111 JSafety application guide on NTC thermistor for used in electric and electronic equipment 2019.09     
RCR-4311 JSafety application guide of varistor 2021.07     
RCR-4800 JSafety application guide on fuse for use in electronic and electrical equipments 2009.10     
RCR-5100 JSafety application guide for use in electronic switches 2002.03  2017.04   
RCR-5202A JSafety Application Guide of connector for use in Electronic Equipment 2001.09
2009.03 		   RCR-5202
 
RCR-9102B JPart count reliability prediction on the switching power supplies (JEITA recommendation) 1994.03
2000.09
2006.06 		 2017.01  RCR-9102A
 RCR-9102A
RCR-9103A JGuide for maintenance and the check of switching power supplies 1999.01
2006.04 		 2015.03  RCR-9103
 
RCR-9105A JSafety Application Guide for Switching Power Supplies 1996.11
2003.01 		 2015.03  RCR-9105
 
TT-2503B JPublic address system for ships 1993.09
1999.12
2014.03 		   TT-2503
TT-2503A
 
TT-3001A JWaveguides and Flanges 1993.09
2004.01 		 2015.02  WG-001
TT-3001
 
TT-3004A J50 ohm rigid coaxial waveguides 1992.03
2002.03 		   WG-002A
TT-3004
 
TT-3005A JFlanges for 50 ohm rigid coaxial waveguides 1992.03
2002.03 		   WG-007A
TT-3005
 
TT-3006A JOrdinary rectangular waveguides 1992.03
2002.03 		 2015.03  WG-16
TT-3006
 
TT-3007A JFlat Waveguides 1993.09
2004.02 		 2015.02  WG-17
TT-3007
 
TT-3008A JCircular waveguides 1995.11
2001.03 		 2015.02  TT-3008
 
TT-3009A JFlanges for ordinary rectangular waveguides 1992.03
1999.03 		 2015.02  TT-3009
 
TT-3010A JFlanges for Flat Waveguides 1993.09
2004.01 		 2015.02  WG-19
TT-3010
 
TT-3011A JFlanges for Circular Waveguides 1993.09
2004.02 		 2015.02  WG-024
TT-3011
 
TT-4501D JMarking Method of Reaching Distance of Sound and Operating Time of Dry Cells on the Transistor-Megaphone 1988.09
1994.03
2006.09
2011.11
2018.11 		   TT-4501A
TT-4501B
TT-4501C
 
TT-4502C JMatching Standard for Interconnection of Public Address Sound System 1989.07
1995.03
2006.01
2014.03 		   CPZ-602
TT-4502A
TT-4502B
 
TT-4503D JTesting Method of Audio Amplifier for Public Address System 1992.03
1999.07
2008.07
2013.04
2025.10 		   TT-4503
TT-4503A
TT-4503B
TT-4503C
 
TT-4506C JLens Mounts (C and CS) for Video Surveillance Cameras 1998.07
2006.04
2014.01
2023.04 		   TT-4506
TT-4506A
TT-4506B
 
TT-4507B JTerms for public address sound system and professional audio equipment 2000.03
2011.07
2016.11 		   TT-4504
TT-4505
TT-4507
TT-4507A
 
TT-6001D JStandard specification for ITS On-Board Unit 2007.03
2008.03
2016.03
2021.04
2025.06 		   TT-6001
TT-6001A
TT-6001B
TT-6001C
 
TT-6002D JStandard specification for DSRC section of ITS On-Board Unit 2007.03
2008.03
2016.03
2021.04
2025.06 		   TT-6002
TT-6002A
TT-6002B
TT-6002C
 
TT-6003C JStandard specification for Car Navigation System section of ITS On-Board Unit 2007.03
2008.03
2016.03
2021.04 		   TT-6003
TT-6003A
TT-6003B
 
TT-6004A JSpeech synthesizer symbols for ITS on-Board Unit 2007.03
2016.03 		   TT-6004
 
TT-6005 JStandard specification for On-Board Unit with Quasi-Zenith Satellite System 2019.12     
TTR-3002A JOrdinary rectangular flexible waveguides 1995.02
2001.03 		 2015.02  TTR-3002
 
TTR-3003A JLong-length flexible weveguides 1995.07
2001.03 		   TTR-3003
 
TTR-3012A JInspection Gauges for Ordinary Rectangular Waveguides and Their Flangdes 1992.03
2003.09 		 2015.02  WGZ-025
TTR-3012
 
TTR-4601E JTerms and Definitions for Video Surveillance Systems Equipment 1994.02
2001.02
2008.06
2015.03
2021.03
2024.12 		   TTR-4601A
TTR-4601B
TTR-4601C
TTR-4601D
 
TTR-4602D JRules of Specification for Video Surveillance Systems Equipment 1994.04
2001.02
2007.06
2015.03
2024.01 		   TTR-4602
TTR-4602A
TTR-4602B
TTR-4602C
 
TTR-4604B JRules of specification for closed circuit television equipment (for peripheral equipment) 1999.12
2006.01
2012.10 		   TTR-4604
TTR-4604A
 
TTR-4605C BRules of Specification for Video Surveillance System Equipment (For Network Camera) 2009.07
2012.04
2018.10
2023.10 		   TTR-4605
TTR-4605A
TTR-4605B
 
TTR-4606A JRules of Specification for Video Surveillance System Equipment (For Network System Equipment) 2020.03
2025.03 		   TTR-4606
 
TTR-4701A JGuideline of Emergency Public Address System corresponding to Earthquake Early Warning System 2011.04
2013.03 		   TTR-4701
 The reading system does not support this standard.
TTR-4702 JGuideline of Speaker Line Splitter 2016.03     The reading system does not support this standard.
TTR-4703A JGuideline of Emergency Public Address System 2017.03
2018.06 		   TTR-4703
 
TTR-4704 JInspection manual of Emergency Public Address System 2023.03     charge-free,click here