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Electronic Devices Standardization
Semiconductor Devices Reliability

No. Title Issue Date Stabilized Former No.
Remarks
ED-4701/001B BEnvironmental and endurance test methods for semiconductor devices (General) 2001.08
2013.10
2023.03 		   ED-4701/001
ED-4701/001A
 
ED-4701/002 EProcedure of the test time and the sample size determination for the life tests 2016.03     The reading system does not support this standard.
ED-4701/100B BEnvironmental and endurance test methods for semiconductor devices (Life test I) 2001.08
2013.08
2023.03 		   ED-4701/100
ED-4701/100A
 
ED-4701/200B BEnvironmental and endurance test methods for semiconductor devices (Life test II) 2001.08
2013.10
2023.03 		   ED-4701/200
ED-4701/200A
 
ED-4701/301A BEnvironmental and endurance test methods for semiconductor devices(Stress test I-1) 2013.11
2016.07 		   ED-4701/301
 
ED-4701/302B BEnvironmental and endurance test methods for semiconductor devices (Stress test I-2) 2013.10
2020.09
2025.02 		   ED-4701/302
ED-4701/302A
 
ED-4701/400B BEnvironmental and endurance test methods for semiconductor devices (Stress test II) 2001.08
2013.11
2023.03 		   ED-4701/400
ED-4701/400A
 
ED-4701/500B BEnvironmental and endurance test methods for semiconductor devices (Miscellaneous) 2001.08
2013.10
2023.03 		   ED-4701/500
ED-4701/500A
 
ED-4701/600 BEnvironmental and endurance test methods for semiconductor devices(Specific test for discrete semiconductors) 2013.12     
ED-4702C BMechanical stress test methods for semiconductor surface mounting devices 1992.10
2003.12
2009.07
2015.03 		   ED-4702
ED-4702A
ED-4702B
 
ED-4703 JIn-line evaluation methods and structural analysis methods for semiconductor devices 1994.06     
ED-4703-1 JIn-line evaluation methods and structural analysis methods for semiconductor devices (Amendment1) 1995.03     
ED-4704A BWafer Level Reliability test methods for semiconductor devices 2000.05
2011.07 		   ED-4704
ED-4704-1
 
ED-4705 BTesting Standards for Reliability of Flash Memory 2009.03     
EDR-4701C BHandling guidance for semiconductor devices 1989.07
1993.02
1996.03
2010.07 		   EDR-4701A
EDR-4701B
 
EDR-4702 JStandard comparison table of quality and reliability test methods for semiconductor devices 1996.03     
EDR-4703A BQuality Assurance Guidelines for Bare Die 1999.05
2008.03 		    
EDR-4704B BApplication guide of the accelerated life test for semiconductor devices 2000.05
2007.03
2020.10 		   EDR-4704A
 
EDR-4705B JSER Testing Guideline
(Refer to EDR-4714 about SEB (Single-Event Burnout).)		 2005.06
2015.07
2023.07 		   EDR-4705
EDR-4705A
 
EDR-4706 BGuide for the Reliability Speciffication of FLASH Memory 2006.01     
EDR-4707A BReport on Failure Mechanism of LSI and reliability test method 2008.03
2018.02 		   EDR-4707
 
EDR-4708C EGuideline for IC Reliability Qualification Plan 2023.06     [CORRIGENDA] JEITA EDR-4708C
EDR-4708C JGuideline for IC Reliability Qualification Plan 2011.04
2013.10
2017.01
2022.10 		   EDR-4708
EDR-4708A
EDR-4708B
 [CORRIGENDA] JEITA EDR-4708C
EDR-4709A BStudy on ESD Test Methods for Semiconductor Components Responding to System Level ESD and Guideline for Assembling on System Boards 2012.07
2019.11 		   EDR-4709
 
EDR-4710 BGuidelines for Handling and ESD Target Levels of Semiconductor Devices 2015.02     
EDR-4711A EGuidelines for Discrete Semiconductor Device Reliability Qualification Plan 2023.03     
EDR-4711A JGuidelines for Discrete Semiconductor Device Reliability Qualification Plan 2016.02
2017.03 		   EDR-4711
 
EDR-4712/100 BNon-destructive recognition procedures of defin Silicon Carbide Wafers (Part 1: Classification of defects) 2016.03     
EDR-4712/200 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 2: The measurement method for defects in Silicon Carbide Wafer by optical inspection) 2017.02     
EDR-4712/400 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 4: The guideline for identifying and evaluating defects in Silicon Carbide Wafers using a combined method of optical inspection and photoluminescence) 2020.12     
EDR-4712/500 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 5: The measurement method for defects in Silicon Carbide Wafer by X-ray topography) 2023.04     
EDR-4713 JGuidelines for Compound Power Semiconductor Device Reliability Test Method 2017.06     
EDR-4713-1 EGuidelines for Compound Power Semiconductor Device Reliability Test Method Amendment 1 2023.11     
EDR-4713-1 JGuidelines for Compound Power Semiconductor Device Reliability Test Method Amendment 1 2023.08     
EDR-4714 JNeutron-Induced SEB Testing Guideline 2022.04     
EDR-4715 EProcedures and Glossary of Terms Semiconductor Failure Analysis (1st Edition) 2022.08     
EDR-4715 JThe Procedure and Technical Terms for Semiconductor Failure Analysis 2020.06     
EDR-4715-1 JThe Procedure and Technical Terms for Semiconductor Failure Analysis (First Edition) Supplementary Edition 2025.01     
EDR-4716 BApplication guide of degradation sign analysis for automotive semiconductor devices 2022.04     
EDR-4717 JGlossary of Semiconductor Device Reliability Terms 2023.07     
EDR4712-300 BNon-destructive recognition procedures of defects in Silicon Carbide Wafers (Part 3: The measurement method for defects in Silicon Carbide Wafer by photoluminescence) 2018.03