MENU

STANDARD

HOME > STANDARD > Electronic Devices Standardization Semiconductor Device Packages

Search by standard title Search by standard number

Electronic Devices Standardization
Semiconductor Device Packages

No. Title Issue Date Stabilized Former No.
Remarks		 Purchase
ED-7300A BRecommended practice on standard for the preparation of outline drawings of semiconductor packages 1997.08
2008.01 		 2013.12  ED-7401A
ED-7300
 
ED-7301A BManual for preparation of individual standards of integrated circuits packages 1996.12
2007.03 		 2013.12  ED-7301
 
ED-7302A BManual for preparation of design guides of integrated circuits packages 1997.04
2007.03 		 2013.12  ED-7401-1
ED-7302
 
ED-7303C BName and code for integrated circuits package 1998.06
2001.03
2002.04
2008.03 		   ED-7303A
 
ED-7304 BMeasuring method for package dimensions of ball grid array (BGA) 1997.05  2014.03   
ED-7304-1 BMeasuring method for package dimensions of Small Outline Package (SOP) 1997.03  2014.03   
ED-7305A BUnit Design Guide for the Preparation of Package Outline Drawing of Integrated Circuits (Gullwing-Lead) 1997.04
2012.04 		   ED-7305
 
ED-7306 BMeasurement methods of package warpage at elevated temperature and the maximum permissible warpage 2007.03     
ED-7311-1 BStandard of integrated circuits package (TSOP(1)) 1997.08     
ED-7311-10A BStandard of integrated circuits package (P-BGA (Cavity down type)) 1998.03
1998.11 		   ED-7311-10
 
ED-7311-11A BStandard of integrated circuits package (119/153pins P-BGA) 1998.03
1998.11 		   ED-7311-11
 
ED-7311-12 BStandard of integrated circuits package (52pins 64pins 80pins and 100pins Low-profile Quad Flat Package with Exposed Heatsink) 1998.08     
ED-7311-13A BStandard of Integrated circuits package (P-SON) 1999.01
2002.06 		   ED-7311-13
 
ED-7311-16A BStandard of integrated circuits package (C-LGA) 2000.06
2003.11 		   ED-7311-14
ED-7311-15
ED-7311-16
 
ED-7311-17 BStandard of integrated circuits package (P-ZIP) 2001.06     
ED-7311-18 BStandard of integrated circuits package (P-ILGA) 2002.03     
ED-7311-19 BStandard of integrated circuits package (P-SOP) 2002.01     
ED-7311-2 BStandard of integrated circuits package (TSOP(2)) 1997.08     
ED-7311-20 BStandard of integrated circuits package (P-SSOP) 2002.01     
ED-7311-21 BStandard of integrated circuits package (P-HSOP) 2002.03     
ED-7311-22 BStandards of integrated circuits package (P-QFN) 2002.04     
ED-7311-23 BStandard of Integrated circuits package (PGA) 2002.06     
ED-7311-3A BStandard of integrated circuits package (Tape Ball Grid Array1.0mm pitch(T-BGA)) 1997.08
1999.04 		   ED-7311-3
 
ED-7311-4A BStandard of integrated circuits package (Tape Ball Grid Array1.27mm pitch (T-BGA)) 1997.08
1999.04 		   ED-7311-4
 
ED-7311-5A BStandard of integrated circuits package (SRAM/Flash Fine- Pitch Ball Grid Array (FBGA)) 1998.04
2000.02 		   ED-7311-5
 
ED-7311-6 BStandard of integrated circuits package (60/90pins Fine Pitch Ball Grid Array (FBGA)) 1998.04     
ED-7311-7 BStandard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.5mm pitch (P-FBGA)) 1998.05     
ED-7311-8 BStandard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.8mm pitch (P-FBGA)) 1998.05     
ED-7311-9A BStandard of integrated circuits package (P-BGA (cavity up type)) 1998.03
1998.11 		   ED-7311-9
 
ED-7311A BStandards of integrated circuits package (P-QFP) 1997.05
2002.04 		   ED-7311
 
ED-7316 BDesign guide for semiconductor packages Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA and FLGA) 2008.09     
ED-7318 BDesign guideline of integrated circuits for Plastic Small Outline No-lead package (P-SON) 2013.03    EDR-7318A
 
ED-7324 BDesign guideline of integrated circuits for Plastic Quad Flat Non-leaded package (P-QFN) 2012.02    EDR-7324A
 
ED-7335 BDesign guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) 2010.02     
ED-7340 JAppearance Glossaryfor Semiconductor Package – QFP/SOP, QFN/SON 2025.01     
ED-7341 JVisual Inspection Guideline for Semiconductor Package – QFP/SOP 2025.01     
ED-7342 JVisual Inspection Guideline for Semiconductor Package – QFN/SON 2025.01     
ED-7401-4 BMethod of measuring semiconductor device package dimensions (integrated circuits) 1995.05  2014.03   
ED-7500B BStandard Outlines of Semiconductor Devices(Discrete Semiconductor Devices) 1990.09
1996.07
2015.03 		   ED-7500
ED-7500A
ED-7500A-1
ED-7500A-2
ED-7500A-3
 
ED-7502A BManual for the preparation of outline drawings of discrete semiconductor packages 2006.06
2013.03 		   ED-7502
 
ED-7607 JMatrix fixed trays design guide 2017.05     
ED-7617 BMatrix trays design guide 2013.12     
ED-7618 JTerms and definitions for semiconductor packing 2017.06     
ED-7631 BMarking method for recycle of semiconductor device packing magazines 2001.01
 		    
ED-7701A BGlossary of semiconductor socket for BGA,LGA,FBGA and FLGA 1999.08
2012.03 		   ED-7701
 
ED-7702A BTest Methods for Test and Burn-In Socket 2003.09
2012.03 		   ED-7702
 
ED-7711 BDesign guideline of open-top type socket for Ball Grid Array(BGA) 2014.10     
ED-7712 BDesign guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array(FBGA/FLGA) 2013.03     
ED-7713 BDesign guideline of clamshell type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array(FBGA/FLGA) 2013.03     
ED-7714 BDesign guideline of clamshell type socket for Ball Grid Array and Land Grid Array(BGA/LGA) 2014.10     
ED-7715 BStandard of open-top type socket [54/66 Pin Thin Small Outline Packages (Type 2)] 2006.03     
ED-7716 BStandard of open-top type socket [Fine-pitch Ball Grid Array (FBGA) for Memort IC] 2006.03     
ED-7800 JTransient thermal network model for semiconductor packages(Discrete semiconductor) 2018.06     
ED-7801 JPrinted circuit board specifications to evaluate thermal characteristics of fine pitch semiconductor packages 2018.06     
ED-7803 JJEITA Thermally Accurate Model 2020.02     
ED-7804 JOverview of transient thermal DXRC model 2022.10     
ED-7805 JDXRC model for semiconductor packages (Discrete semiconductor) 2022.10     
ED-7806 JDNRC model for semiconductor packages (Discrete semiconductor) 2023.04     
ED-7807 JDSRC model for semiconductor packages (Discrete semiconductor) 2023.04     
EDR-7311A BDesign guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) 1996.04
2002.04 		   ED-7404A
EDR-7311
 
EDR-7312 BDesign guideline of integrated circuits for thin small outline package (type1) (TSOPI) 1996.04    ED-7402-3
 
EDR-7313 BDesign guideline of integrated circuits for thin small outline package (type 2) (TSOP2) 1996.04    ED-7402-4A
 
EDR-7314A BDesign guideline of integrated circuits for Plastic Shrink Small Outline Package (P-SSOP) 1996.08
2002.01 		   ED-7402-2A
EDR-7314
 
EDR-7315B BDesign guide for semiconductor packages Ball Grid Array (BGA) 1997.05
1998.11
2006.03 		   EDR-7315A
 
EDR-7317 BDesign guideline of integrated circuits for Surface Vertical Package (SVP) 1998.05    ED-7424
 
EDR-7319 BDesign guideline of integrated circuits for Quad Flat J-Lead Packages (QFJ) 1998.12    ED-7407
 
EDR-7320 BDesign guideline of integrated circuits for Small Outline Package (SOP) 1998.12    ED-7402-1
 
EDR-7321 BDesign guideline of integrated circuits for Quad Flat I-lead package (QFI) 1999.02    ED-7409
 
EDR-7322 BDesign guideline of integrated circuits for Plastic Dual Inline Package (DIP) 1999.04    ED-7403-1
 
EDR-7323A BDesign guideline of integrated circuits for Pin Grid Array (PGA) 1999.05
2002.06 		   EDR-7323
 
EDR-7325 BDesign guideline of integrated circuits for Quad Flat Non-leaded packages (QFN) 1999.05    ED-7412
 
EDR-7326A BDesign guideline of integrated circuits for Plastic Small Outline Package with Heat sink (P-HSOP) 1999.12
2002.03 		   ED-7415
EDR-7326
 
EDR-7327 BDesign guideline of integrated circuits for Single Inline Package (SIP) 2001.01    ED-7413
 
EDR-7328 BDesign guideline of integrated circuits for Plastic Zigzag Inline Package (P-ZIP) 2001.09    ED-7405
ED-7405-1
 
EDR-7329 BDesign guideline of integrated circuits for Plastic Interstitial Land Grid Array package (P-ILGA) 2002.03     
EDR-7330 BDesign guideline of integrated circuits for Plastic Small Outline J-Lead package (P-SOJ) 2002.06     
EDR-7331 BDesign guideline of integrated circuits for Quad Tape Carrier packages and Carrier (QTP and Carrier) 2002.09    ED-7431A
ED-7431-1A
 
EDR-7332 BDesign guideline of integrated circuits for Dual Tape Carrier packages (TYPE1, TYPE2) (DTP(1), DTP(2)) 2002.09    ED-7432
ED-7433
 
EDR-7333 BDesign Guide for Stacked Packages Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA) 2008.05     
EDR-7334 BEvaluation results of typical measurement methods of temperature dependent warpage 2008.05     
EDR-7335 EGlossary for Semiconductor packages (Volum 1:Semiconductor package name and parts name) 2011.09     
EDR-7335 JGlossary for Semiconductor packages (Volume 1: Semiconductor package name and parts name) 2010.11     
EDR-7336 EPackage thermal characteristics guideline in semiconductor products 2014.01     
EDR-7336 JPackage thermal characteristic guideline in semiconductor product 2010.10     
EDR-7337 EThermal characteristics guidelines of two chip stacked semiconductor packages 2015.03     
EDR-7337 JThermal characteristics guidelines of two chip stacked semiconductor packages 2013.10     
EDR-7338 JTemperature measurement guideline using a thermocouple 2016.02     
EDR-7339A JGuideline for package thermal characteristic of power semiconductor module 2022.03
2025.05 		   EDR-7339
 
EDR-7340 JThermal conductivity measurement guideline for semiconductor packaging materials "Molding resin" 2024.11     
EDR-7341 JTechnical summary of thermal model for semiconductor packages 2024.11     
EDR-7402 JLow Cl and Br Molding Compound 2021.11     
EDR-7501 JGuideline for applying geometric tolerances to outline drawing of power semiconductor module 2025.11     
EDR-7605 BMarking guideline of packing for lead-free semiconductor device 2004.01     
EDR-7619 JSupplying reel of embossed carrier tape　for semiconductor devices 2013.12     
EDR-7714 BDesign guideline of clamshell type socket for Ball Grid Array and Land Grid array(BGA/LGA) 2008.03     
EDR-7717 JPositioning simulation of semiconductor sockets Technical reports 2010.03     
EDR-7718 JPositioning simulation of semiconductor sockets Technical reports(Socket type FBGA) 2011.04     The reading system does not support this standard.
EDR-7719 JPositioning simulation of semiconductor sockets Technical reports [Socket type QFP] 2014.10     
EDX-7311-24 BMeasurement methods and maximum warpage allowance for soldering stacked packages at elevated temperature 2008.05