|
Order |
NO. |
Title |
Issue
Date |
Price
(Yen) |
Former No.
Remarks |
Stabilized |
|
|
ED-7300A |
Recommended practice on standard for the preparation of outline drawings of semiconductor packages
|
1997.08
2008.01 |
5,657 |
ED-7401A
ED-7300
|
2013.12 |
|
|
ED-7301A |
Manual for preparation of individual standards of integrated circuits packages
|
1996.12
2007.03 |
3,143 |
ED-7301
|
2013.12 |
|
|
ED-7302A |
Manual for preparation of design guides of integrated circuits packages
|
1997.04
2007.03 |
3,562 |
ED-7401-1
ED-7302
|
2013.12 |
|
|
ED-7303C |
Name and code for integrated circuits package
|
1998.06
2001.03
2002.04
2008.03 |
3,982 |
ED-7303A
|
|
|
|
ED-7304 |
Measuring method for package dimensions of ball grid array (BGA)
|
1997.05 |
5,867 |
|
2014.03 |
|
|
ED-7304-1 |
Measuring method for package dimensions of Small Outline Package (SOP)
|
1997.03 |
4,400 |
|
2014.03 |
|
|
ED-7305A |
Unit Design Guide for the Preparation of Package Outline Drawing of Integrated Circuits (Gullwing-Lead)
|
1997.04
2012.04 |
2,514 |
ED-7305
|
|
|
|
ED-7306 |
Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
|
2007.03 |
5,029 |
|
|
|
|
ED-7311-1 |
Standard of integrated circuits package (TSOP(1))
|
1997.08 |
2,619 |
|
|
|
|
ED-7311-10A |
Standard of integrated circuits package (P-BGA (Cavity down type))
|
1998.03
1998.11 |
6,810 |
ED-7311-10
|
|
|
|
ED-7311-11A |
Standard of integrated circuits package (119/153pins P-BGA)
|
1998.03
1998.11 |
1,991 |
ED-7311-11
|
|
|
|
ED-7311-12 |
Standard of integrated circuits package (52pins 64pins 80pins and 100pins Low-profile Quad Flat Package with Exposed Heatsink)
|
1998.08 |
2,305 |
|
|
|
|
ED-7311-13A |
Standard of Integrated circuits package (P-SON)
|
1999.01
2002.06 |
2,933 |
ED-7311-13
|
|
|
|
ED-7311-16A |
Standard of integrated circuits package (C-LGA)
|
2000.06
2003.11 |
8,171 |
ED-7311-14
ED-7311-15
ED-7311-16
|
|
|
|
ED-7311-17 |
Standard of integrated circuits package (P-ZIP)
|
2001.06 |
2,724 |
|
|
|
|
ED-7311-18 |
Standard of integrated circuits package (P-ILGA)
|
2002.03 |
2,514 |
|
|
|
|
ED-7311-19 |
Standard of integrated circuits package (P-SOP)
|
2002.01 |
9,848 |
|
|
|
|
ED-7311-2 |
Standard of integrated circuits package (TSOP(2))
|
1997.08 |
3,248 |
|
|
|
|
ED-7311-20 |
Standard of integrated circuits package (P-SSOP)
|
2002.01 |
14,667 |
|
|
|
|
ED-7311-21 |
Standard of integrated circuits package (P-HSOP)
|
2002.03 |
5,238 |
|
|
|
|
ED-7311-22 |
Standards of integrated circuits package (P-QFN)
|
2002.04 |
6,705 |
|
|
|
|
ED-7311-23 |
Standard of Integrated circuits package (PGA)
|
2002.06 |
7,124 |
|
|
|
|
ED-7311-3A |
Standard of integrated circuits package (Tape Ball Grid Array1.0mm pitch(T-BGA))
|
1997.08
1999.04 |
5,133 |
ED-7311-3
|
|
|
|
ED-7311-4A |
Standard of integrated circuits package (Tape Ball Grid Array1.27mm pitch (T-BGA))
|
1997.08
1999.04 |
2,619 |
ED-7311-4
|
|
|
|
ED-7311-5A |
Standard of integrated circuits package (SRAM/Flash Fine- Pitch Ball Grid Array (FBGA))
|
1998.04
2000.02 |
2,410 |
ED-7311-5
|
|
|
|
ED-7311-6 |
Standard of integrated circuits package (60/90pins Fine Pitch Ball Grid Array (FBGA))
|
1998.04 |
1,991 |
|
|
|
|
ED-7311-7 |
Standard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.5mm pitch (P-FBGA))
|
1998.05 |
9,638 |
|
|
|
|
ED-7311-8 |
Standard of integrated circuits package (Plastic Fine Pitch Ball Grid Array 0.8mm pitch (P-FBGA))
|
1998.05 |
7,229 |
|
|
|
|
ED-7311-9A |
Standard of integrated circuits package (P-BGA (cavity up type))
|
1998.03
1998.11 |
7,438 |
ED-7311-9
|
|
|
|
ED-7311A |
Standards of integrated circuits package (P-QFP)
|
1997.05
2002.04 |
11,105 |
ED-7311
|
|
|
|
ED-7316 |
Design guide for semiconductor packages Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA and FLGA)
|
2008.09 |
6,076 |
|
|
|
|
ED-7318 |
Design guideline of integrated circuits for Plastic Small Outline No-lead package (P-SON)
|
2013.03 |
3,982 |
EDR-7318A
|
|
|
|
ED-7324 |
Design guideline of integrated circuits for Plastic Quad Flat Non-leaded package (P-QFN)
|
2012.02 |
4,610 |
EDR-7324A
|
|
|
|
ED-7335 |
Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
|
2010.02 |
4,400 |
|
|
|
|
ED-7401-4 |
Method of measuring semiconductor device package dimensions (integrated circuits)
|
1995.05 |
4,819 |
|
2014.03 |
|
|
ED-7500B |
Standard Outlines of Semiconductor Devices(Discrete Semiconductor Devices)
|
1990.09
1996.07
2015.03 |
19,800 |
ED-7500
ED-7500A
ED-7500A-1
ED-7500A-2
ED-7500A-3
|
|
|
|
ED-7502A |
Manual for the preparation of outline drawings of discrete semiconductor packages
|
2006.06
2013.03 |
6,286 |
ED-7502
|
|
|
|
ED-7607 |
Matrix fixed trays design guide
|
2017.05 |
2,090 |
|
|
|
|
ED-7617 |
Matrix trays design guide
|
2013.12 |
7,962 |
|
|
|
|
ED-7618 |
Terms and definitions for semiconductor packing
|
2017.06 |
2,420 |
|
|
|
|
ED-7631 |
Marking method for recycle of semiconductor device packing magazines
|
2001.01
|
2,305 |
|
|
|
|
ED-7701A |
Glossary of semiconductor socket for BGA,LGA,FBGA and FLGA
|
1999.08
2012.03 |
2,933 |
ED-7701
|
|
|
|
ED-7702A |
Test Methods for Test and Burn-In Socket
|
2003.09
2012.03 |
10,057 |
ED-7702
|
|
|
|
ED-7711 |
Design guideline of open-top type socket for Ball Grid Array(BGA)
|
2014.10 |
4,840 |
|
|
|
|
ED-7712 |
Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array(FBGA/FLGA)
|
2013.03 |
4,819 |
|
|
|
|
ED-7713 |
Design guideline of clamshell type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array(FBGA/FLGA)
|
2013.03 |
4,610 |
|
|
|
|
ED-7714 |
Design guideline of clamshell type socket for Ball Grid Array and Land Grid Array(BGA/LGA)
|
2014.10 |
4,840 |
|
|
|
|
ED-7715 |
Standard of open-top type socket [54/66 Pin Thin Small Outline Packages (Type 2)]
|
2006.03 |
2,305 |
|
|
|
|
ED-7716 |
Standard of open-top type socket [Fine-pitch Ball Grid Array (FBGA) for Memort IC]
|
2006.03 |
2,410 |
|
|
|
|
ED-7800 |
Transient thermal network model for semiconductor packages(Discrete semiconductor)
|
2018.06 |
3,850 |
|
|
|
|
ED-7801 |
Printed circuit board specifications to evaluate thermal characteristics of fine pitch semiconductor packages
|
2018.06 |
3,300 |
|
|
|
|
ED-7803 |
JEITA Thermally Accurate Model
|
2020.02 |
3,740 |
|
|
|
|
EDR-7311A |
Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP)
|
1996.04
2002.04 |
6,495 |
ED-7404A
EDR-7311
|
|
|
|
EDR-7312 |
Design guideline of integrated circuits for thin small outline package (type1) (TSOPI)
|
1996.04 |
3,982 |
ED-7402-3
|
|
|
|
EDR-7313 |
Design guideline of integrated circuits for thin small outline package (type 2) (TSOP2)
|
1996.04 |
4,191 |
ED-7402-4A
|
|
|
|
EDR-7314A |
Design guideline of integrated circuits for Plastic Shrink Small Outline Package (P-SSOP)
|
1996.08
2002.01 |
6,076 |
ED-7402-2A
EDR-7314
|
|
|
|
EDR-7315B |
Design guide for semiconductor packages Ball Grid Array (BGA)
|
1997.05
1998.11
2006.03 |
4,819 |
EDR-7315A
|
|
|
|
EDR-7317 |
Design guideline of integrated circuits for Surface Vertical Package (SVP)
|
1998.05 |
3,352 |
ED-7424
|
|
|
|
EDR-7319 |
Design guideline of integrated circuits for Quad Flat J-Lead Packages (QFJ)
|
1998.12 |
4,819 |
ED-7407
|
|
|
|
EDR-7320 |
Design guideline of integrated circuits for Small Outline Package (SOP)
|
1998.12 |
3,143 |
ED-7402-1
|
|
|
|
EDR-7321 |
Design guideline of integrated circuits for Quad Flat I-lead package (QFI)
|
1999.02 |
3,143 |
ED-7409
|
|
|
|
EDR-7322 |
Design guideline of integrated circuits for Plastic Dual Inline Package (DIP)
|
1999.04 |
4,400 |
ED-7403-1
|
|
|
|
EDR-7323A |
Design guideline of integrated circuits for Pin Grid Array (PGA)
|
1999.05
2002.06 |
6,495 |
EDR-7323
|
|
|
|
EDR-7325 |
Design guideline of integrated circuits for Quad Flat Non-leaded packages (QFN)
|
1999.05 |
3,982 |
ED-7412
|
|
|
|
EDR-7326A |
Design guideline of integrated circuits for Plastic Small Outline Package with Heat sink (P-HSOP)
|
1999.12
2002.03 |
6,705 |
ED-7415
EDR-7326
|
|
|
|
EDR-7327 |
Design guideline of integrated circuits for Single Inline Package (SIP)
|
2001.01 |
3,352 |
ED-7413
|
|
|
|
EDR-7328 |
Design guideline of integrated circuits for Plastic Zigzag Inline Package (P-ZIP)
|
2001.09 |
4,400 |
ED-7405
ED-7405-1
|
|
|
|
EDR-7329 |
Design guideline of integrated circuits for Plastic Interstitial Land Grid Array package (P-ILGA)
|
2002.03 |
5,029 |
|
|
|
|
EDR-7330 |
Design guideline of integrated circuits for Plastic Small Outline J-Lead package (P-SOJ)
|
2002.06 |
7,124 |
|
|
|
|
EDR-7331 |
Design guideline of integrated circuits for Quad Tape Carrier packages and Carrier (QTP and Carrier)
|
2002.09 |
9,848 |
ED-7431A
ED-7431-1A
|
|
|
|
EDR-7332 |
Design guideline of integrated circuits for Dual Tape Carrier packages (TYPE1, TYPE2) (DTP(1), DTP(2))
|
2002.09 |
7,752 |
ED-7432
ED-7433
|
|
|
|
EDR-7333 |
Design Guide for Stacked Packages Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
|
2008.05 |
6,495 |
|
|
|
|
EDR-7334 |
Evaluation results of typical measurement methods of temperature dependent warpage
|
2008.05 |
3,771 |
|
|
|
|
EDR-7335 |
Glossary for Semiconductor packages (Volum 1:Semiconductor package name and parts name)
|
2011.09 |
0 |
|
|
|
|
EDR-7335 |
Glossary for Semiconductor packages (Volume 1: Semiconductor package name and parts name)
|
2010.11 |
2,724 |
|
|
|
|
EDR-7336 |
Package thermal characteristics guideline in semiconductor products
|
2014.01 |
0 |
|
|
|
|
EDR-7336 |
Package thermal characteristic guideline in semiconductor product
|
2010.10 |
3,771 |
|
|
|
|
EDR-7337 |
Thermal characteristics guidelines of two chip stacked semiconductor packages
|
2015.03 |
0 |
|
|
|
|
EDR-7337 |
Thermal characteristics guidelines of two chip stacked semiconductor packages
|
2013.10 |
0 |
|
|
|
|
EDR-7338 |
Temperature measurement guideline using a thermocouple
|
2016.02 |
0 |
|
|
|
|
EDR-7605 |
Marking guideline of packing for lead-free semiconductor device
|
2004.01 |
2,095 |
|
|
|
|
EDR-7619 |
Supplying reel of embossed carrier tape@for semiconductor devices
|
2013.12 |
0 |
|
|
|
|
EDR-7714 |
Design guideline of clamshell type socket for Ball Grid Array and Land Grid array(BGA/LGA)
|
2008.03 |
4,610 |
|
|
|
|
EDR-7717 |
Positioning simulation of semiconductor sockets Technical reports
|
2010.03 |
3,143 |
|
|
|
|
EDR-7718 |
Positioning simulation of semiconductor sockets Technical reports(Socket type FBGA)
|
2011.04 |
0 |
The reading system does not support this standard. |
|
|
|
EDR-7719 |
Positioning simulation of semiconductor sockets Technical reports [Socket type QFP]
|
2014.10 |
3,190 |
|
|
|
|
EDX-7311-24 |
Measurement methods and maximum warpage allowance for soldering stacked packages at elevated temperature
|
2008.05 |
3,562 |
|
|
