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Electronics Assembly System Standardization
Electronics Assembly System

No. Title Issue Date Stabilized Former No.
Remarks		 Price (Yen)
ET-7104 JStandard about reality of packaging of components for automatic handling affects mounting and related electrostatic standards judged from these packaging 2016.04      ￥5,940
ET-7104-1

ET-7104-2		 JMeasuring methods of electrostatic potential and charge decay while cover tape is peeled off from carrier of SMD taping

Additional notes of measuring methods of electrostatic potential and charge decay while cover tape is peeled off from carrier of SMD taping (JEITA ET-7104-1)[2018.02]		 2016.04      ￥2,420
ET-7105 EStandard on paper taping specifications required　for AUTO LOADING FEEDER 2019.08      ￥3,190
ET-7105 JStandard on paper taping specifications required for AUTO LOADING FEEDER 2018.11      ￥2,750
ET-7200C JReusable reel for packaging of components for automatic handling 1997.07
1999.12
2003.10
2010.10 		   ET-7200
ET-7200A
ET-7200B
 		 ￥3,982
ET-7304A EDefinition of Halogen-free Soldering Materials 2009.03
2010.04 		   ET-7304
 		 ￥3,562
ET-7305 JGuideline for Selection of Lead-Free Materials for Tin-Whisker Mitigation 2010.06      ￥5,867
ET-7404 JSolderability testing of electronic components for surface mount technology by the wetting balance method with solder paste 1997.03
 		     ￥2,410
ET-7405 BTest methods of ultrasonic cleaning exposure of surface mounting devices 1998.03
 		   RCX-0103
 		 ￥2,305
ET-7407B JEndurance test methods of solder joint for CSP and BGA package on mounting condition 1999.12
2010.06
2012.12 		   ET-7407
ET-7407A
 		 ￥5,552
ET-7409/101A JTest methods for solder joint of surface mount device - Part101: Pull strength test 2005.11
2010.04 		   ET-7409/101
 		 ￥2,724
ET-7409/102A JTest methods for solder joint of surface mount device - Part102: Shear strength test 2005.11
2010.04 		   ET-7409/102
 		 ￥3,248
ET-7409/103A JTest methods for solder joint of surface mount device - Part103: Torque shear strength test 2005.11
2010.04 		   ET-7409/103
 		 ￥3,038
ET-7409/104A JTest methods for solder joint of surface mount device - Part104: Monotonic bending strength test 2005.11
2010.04 		   ET-7409/104
 		 ￥2,724
ET-7409/105A JTest methods for solder joint of surface mount device - Part105 : Cyclic bending strength test 2005.11
2010.04 		   ET-7409/105
 		 ￥2,724
ET-7409/106A JTest methods for solder joint of surface mount device - Part106：Cyclic drop test 2005.11
2010.04 		   ET-7409/106
 		 ￥3,248
ET-7409/107 JTest methods for solder joint of surface mount device - Part107：Cyclic steel ball drop test 2010.04      ￥2,514
ET-7409/201 ESurface mount technology-Environmental and endurance test methods for solder joint of lead terminal type device Part201: Pull strength test 2005.11     charge-free,click here ￥0
ET-7409/202 ESurface mount technology-Environmental and endurance test methods for solder joint of lead terminal type device Part202: Creep strength test 2005.11     charge-free,click here ￥0
ET-7409A JSurface mount technology-Environmental and endurance test methods for solder joint of surface mount device or lead terminal type device Part0: Selection of the test methods 2005.11
2008.07 		   ET-7409
 		 ￥3,771
ET-7411 JENVIRONMENTAL TESTING: Solderability testing of electronic components for miniature surface mounting devices by the wetting balance method 2009.04      ￥2,829
ET-7501 JLand pattern design guideline for surface mount devices (SMDS) : Generic requirements 2003.03
 		     ￥3,143
ET-7501-1 BDrawing guidline for the outline of surface mount devices (SMDs) for land pattern design 2014.03      ￥6,160
ET-7501/101 JLand pattern design for surface mount devices (SMDs) : Sectional requirements (Rectangular or square-end components, cylindrical end cap terminations, Inward L shaped ribbon leads, Flat leads) 2003.03
 		     ￥4,924
ET-7501/105 JLand pattern design guideline for surface mount devices (SMDs) : Sectional requirements (Chip carriers with J-Leads on four sides) 2006.09      ￥2,410
ET-7503 JComponent shape data specification for CAD libraly - Generic descriptions of the 2D and 3D descriptions for components shape data 2012.09      ￥2,410
ET-7504 B3D data design guideline for Part technical information utilization of electronic and electronics components 2014.03      ￥4,180
ET-7505A JRequirements for through hole reflow (THR) soldering 2018.04
2020.06 		   ET-7505
 		 ￥4,180
ET-7506 JRequirements for terminal coplanarity of electronic components at room temperature and reflow heating 2020.07      ￥5,170
ETR-7001 BTerms and definitions for surface mount technology 1998.09
 		     ￥11,419
ETR-7002 JGuideline for promotion of recovery and reuse about reusable reel for tape packaging of surface mount device 1996.08
 		     ￥4,400
ETR-7005 JReport of investigation on bulk case for surface mounting devices 1997.06
 		     ￥5,552
ETR-7009 JGuideline for practical use of Reusable bulk case for surface mounting devices 2000.03      ￥5,133
ETR-7011 JGuide for reusable and/or recycable mark on containers and packaging for electronic components 2001.04
 		     ￥2,933
ETR-7013A JGuideline for bulk feeding 2002.07
2009.03
 		   ETR-7013
 		 ￥3,876
ETR-7014 JReport of investigation on bulk feeding and mounting for chip resistors rectangular type 2002.03
 		     ￥2,724
ETR-7015 JReport of evaluation on miniature bulk case for surface mounting components 2002.03
 		     ￥3,352
ETR-7016

ETR-7016-1
 JReport of investigation on mechanical matching between bulkcased SMDs and feeding mechanism

Report of investigation on mecanical matching between bulkcased SMDs and feeding mechanism Amendment 1(2003.04)

 2002.03
 		     ￥6,391
ETR-7017 JInvestigative report of problem for Packaging of surface mount components on continuous tapes 2003.08
 		     ￥4,191
ETR-7022 JGuidance of taping for surface mount components 2004.04
 		     ￥3,143
ETR-7023 JSecond-generation Flow Solder Alloy Standardization Project Group Activity Report 2007.06      ￥10,476
ETR-7024 JResearch Report on Effect of Voids on Reliability of Lead-Free Solder Joints and Standard of Evaluation Criteria 2007.06      ￥15,714
ETR-7025 JInvestigation report on W8P1 specifications(8 mm in width,1 mm in pocket pitch)in tape packaging of surface mount components 2009.04
 		     ￥2,410
ETR-7026 JTerms and definitions for packaging of components on automatic handling 2007.04      ￥4,086
ETR-7027 JSecond-generation Reflow Solder Paste Standardization Project Group Activity Report(I) 2011.11      ￥5,133
ETR-7028 ESecond-generation Reflow Solder Paste Standardization Project Group Activity Report (Final) 2012.10      ￥6,810
ETR-7028 JSecond-generation Reflow Solder Paste Standardization Project Group Activity Report(Final) 2012.10      ￥6,810
ETR-7029 JSurvey and Evaluation of some alternative Lead-free solders for high melting temperature Lead containing solders 2017.03      ￥7,150
ETR-7030 ETechnical report on emboss taping specifications required forfor AUTO LOADING FEEDER 2019.08      ￥3,850
ETR-7030 JTechnical report on emboss taping specifications required for AUTO LOADING FEEDER 2018.11      ￥3,080
ETR-7031 JExperimental proving test report of Sn-Ag-Cu solder joint life prediction 2019.03      ￥3,740
ETR-7032 JGuidelines on current temperature regulation and issues regarding the operating temperatures of electrical and electronic components 2020.11      ￥3,872
ETR-7033 JGuidelines for measuring temperature of electric and electronic components 2021.01      ￥10,043
ETR-7034 JThermal design guidelines for printed circuit boards with mounted components that dissipate heat through the board 2021.01      ￥5,808
ETR-7035 BInterim report of survey and evaluation of Sn whisker growth on low-temperature soldering 2021.06      ￥8,140