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JEITA Standards
Order Summary
Electronics Assembly System Standardization
Electronics Assembly System
Please read first JapaneseJapanese EnglishEnglish Both Japanese & EnglishBoth Japanese & English
Order
NO.
Title
Issue
Date
Price
(Yen)
Former No.
Remarks
  ET-7001 Japanese The marking for presence and non-presence of the specific chemical substances in materials, components and mounted boards use in electrical and electronic equipment 2005.07  3,800
  ET-7102 Japanese Packaging of Electronic Components with unidirectional leads on Continuous Tapes 2003.03  3,900
  ET-7103A Japanese Packaging of surface mount components on press carrier tapes 2009.05  2,500 ET-7103
  ET-7200B Japanese Reusable reel for packaging of components for automatic handling 1997.07
2003.10		  3,700 ET-7200
ET-7200A
  ET-7201A Both Japanese & English Reusable bulk case for surface mounting devices 1996.08  4,000 ET-7201
  ET-7303 Japanese Standard Form for Indicating Characteristics and Performance on Screen Printer for SMT 1998.02  2,000
  ET-7304 Both Japanese & English Definition of Halogen-free Soldering Materials 2009.03  5,200
  ET-7401 Japanese Solderability testing of electronic components for surface mount technology by the wetting balance method 1996.03  3,200
  ET-7404 Japanese Solderability testing of electronic components for surface mount technology by the wetting balance method with solder paste 1997.03  2,300
  ET-7405 Both Japanese & English Test methods of ultrasonic cleaning exposure of surface mounting devices 1998.03  2,200 RCX-0103
  ET-7407 Both Japanese & English Environmental and endurance test methods for CSP/BGA package on mounting condition 1999.12  9,400
  ET-7409/101 Japanese Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device Part101: Pull strength test 2005.11  2,600
  ET-7409/102 Japanese Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device Part102: Shear strength test 2005.11  3,000
  ET-7409/103 English Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device Part103: Torque shear strength test 2005.11  0 charge-free,click here
  ET-7409/104 English Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device Part104: Monotonic bending strength test 2005.11  0 charge-free,click here
  ET-7409/105 Japanese Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device Part105: Cyclic bending strength test 2005.11  2,500
  ET-7409/106 Japanese Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device Part106: Cyclic drop test 2005.11  3,000
  ET-7409/201 English Surface mount technology-Environmental and endurance test methods for solder joint of lead terminal type device Part201: Pull strength test 2005.11  0 charge-free,click here
  ET-7409/202 English Surface mount technology-Environmental and endurance test methods for solder joint of lead terminal type device Part202: Creep strength test 2005.11  0 charge-free,click here
  ET-7409A Japanese Surface mount technology-Environmental and endurance test methods for solder joint of surface mount device or lead terminal type device Part0: Selection of the test methods 2008.07  3,500 ET-7409
  ET-7410 Japanese Whisker test methods on components for use in electrical and electronic equipment 2005.12  2,400
  ET-7411 Japanese ENVIRONMENTAL TESTING: Solderability testing of electronic components for miniature surface mounting devices by the wetting balance method 2009.04  2,700
  ET-7501 Japanese Land pattern design guideline for surface mount devices (SMDS) : Generic requirements 2003.03  3,000
  ET-7501/101 Japanese Land pattern design for surface mount devices (SMDs) : Sectional requirements (Rectangular or square-end components, cylindrical end cap terminations, Inward L shaped ribbon leads, Flat leads) 2003.03  4,700
  ET-7501/105 Japanese Land pattern design guideline for surface mount devices (SMDs) : Sectional requirements (Chip carriers with J-Leads on four sides) 2006.09  2,300
  ETR-7001 Both Japanese & English Terms and definitions for surface mount technology 1998.09  10,900
  ETR-7002 Japanese Guideline for promotion of recovery and reuse about reusable reel for tape packaging of surface mount device 1996.08
2004.06		  4,200
  ETR-7003 Japanese Report of investigation on solvents used in solvent resistance test 1996.01  3,700
  ETR-7005 Japanese Report of investigation on bulk case for surface mounting devices 1997.06  5,300
  ETR-7007 Japanese Report of Investigation on Lead Free Solder and New Joining Materials 1998.07  4,700
  ETR-7009 Japanese Guideline for practical use of Reusable bulk case for surface mounting devices 2000.03  4,900
  ETR-7011 Japanese Guide for reusable and/or recycable mark on containers and packaging for electronic components 2001.04  2,800
  ETR-7013A Japanese Guideline for bulk feeding 2002.07
2009.03		  3,700 ETR-7013
  ETR-7014 Japanese Report of investigation on bulk feeding and mounting for chip resistors rectangular type 2002.03  2,600
  ETR-7015 Japanese Report of evaluation on miniature bulk case for surface mounting components 2002.03  3,200
  ETR-7016 Japanese Report of investigation on mechanical matching between bulkcased SMDs and feeding mechanism 2002.03  6,100
  ETR-7016-1 Japanese Report of investigation on mecanical matching between bulkcased SMDs and feeding mechanism Amendment 1 2003.04  6,100 package deal with ETR-7016
  ETR-7017 Japanese Investigative report of problem for Packaging of surface mount components on continuous tapes 2003.08  4,000
  ETR-7021 Japanese Guidance for the lead-free marking of materials, components and mounted boards used in electronic and electric equipment 2004.06  4,500
  ETR-7022 Japanese Guidance of taping for surface mount components 2004.04  3,000
  ETR-7023 Japanese Second-generation Flow Solder Alloy Standardization Project Group Activity Report 2007.06  10,000
  ETR-7024 Japanese Research Report on Effect of Voids on Reliability of Lead-Free Solder Joints and Standard of Evaluation Criteria 2007.06  15,000
  ETR-7025 Japanese Investigation report on W8P1 specifications(8 mm in width,1 mm in pocket pitch)in tape packaging of surface mount components 2009.04  2,300
  ETR-7026 Japanese Terms and definitions for packaging of components on automatic handling 2007.04  3,900
  ETX-7112 Japanese Reusable bulk case packaging for surface mounting components- Large case 2000.03  2,400
 
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